Amkor Technology offers advanced thermal test measurement capability and state-of-the-art modeling capabilities supporting all major electronic packaging styles.
Cold plate facilities are available for measuring Theta JC and Theta JB
Amkor’s closed loop wind tunnel is capable of controlling airflow from 50 to 1600 LPM and air temperature from 18°C to 65°C. The tunnel spatial uniformity of velocity is ±1% of the mean value. The test section is 12 x 12 inches with a contraction area of 6.5:1. Up to three boards can be tested simultaneously. A data acquisition and control system provides automated testing over a preset range of flow rate and power levels. Steady state convergence tests, based on die level temperature, are used before stepping to the next power / flow condition. Data is retrieved automatically and stored in an database filing system.
Amkor maintains a library of JEDEC standard leaded and array format 1S0P and 1S2P test boards. Custom board design capabilities are also available.
Amkor amassed over 200 thermal test reports covering a wide array of packages ranging from power application packages such as a PSOP 2 & 3, leaded packages such as LQFP, exposed pad packages such as MLFs and array packages such as PBGA. Thermal data includes theta ja over a range of power levels at flow velocities from 0.0 to 2.5m/s. Psi JT, Psi JB and Theta JC data are available in many of the thermal reports.
Amkor employs advanced thermal modeling techniques using finite element analysis (FEA). A CAD-based modeling approach developed at Amkor has consistently shown a 98% accuracy level when compared against test data. Individual details such as traces, vias, solder balls, etc. are explicitly modeled.
Turnkey thermal models are also available using Ansys' parametric modeling capabilities. Fewer geometrical details are considered but the models are fully automated. Typical accuracy is 98% or higher.
Quick thermal calculators are available for many package styles. Immediate thermal resistance estimations are available via Web.data.
Custom thermal solutions are available at Amkor to optimize component level designs. This may include laminate or leadframe design optimization, material property evaluation and board layout analyses.
Compact thermal models are available for predicting die temperature in system level performance. They are developed to provide "boundry condition independent" peak die temperature predictions.
CFD models are used to more closely predict package performance in custom enviroments. This includes local flow conditions, system packaging and thermal interaction from neighboring components.