Amkor's Die Processing operation offers a wide range of services for the WLCSP, flip chip and bare die industry. All processes are conducted in a Class 10K clean room environment using state-of-the-art equipment. Services include back grind, die prep, inspection, and pick and place into tape or trays. Die inspection capabilities include commercial and military Mil-Std-883 Condition B. Flip chip bump inspection is also available for gold and solder bumped product. In addition, special processing and shipping services are available upon request.
Production Facility
Amkor's primary Die Processing operation is located at the P1 factory in the Philippines. Amkor also has die processing operations dedicated to support WLCSP in Taiwan.
Markets Served
Amkor serves a wide range of semiconductor manufacturers and producers of portable and wireless communications products, multimedia and entertainment systems, network computing and automotive electronics. The die are used in multi-chip modules (MCM), flip chip, and chip-on-board applications.
Amkor's Die Processing Advantage:
Amkor’s Die Processing service offers several advantages to the customer.
- Provides an efficient turnkey solution to supply inspected, packaged die for use in flip chip or chip-on-board applications
- Avoids the need for the chip supplier to invest in the manufacturing infrastructure for handling and packaging bare die
- Provides the confidence in working with the leading supplier of semiconductor subcontract assembly and test services with extensive experience in die processing and component packaging
Details of Services:
- Class 10K Clean Room Environment
- Up to 12 " Wafer Capability
- Backgrinding
- Inkless Processing
- Wide range of die sizes (0.4mm to 26mm square)
- Full Die Preparation (Wafer mount, Saw, Clean)
- Wide Range of Markets Served
- Wireless, Portable Communications
- Network / Computing
- Automotive - Wide Selection of Carrier Options
- Pocket tape (8.0 mm, 12.0 mm, 16.0 mm, Custom Configurations
- Waffle pack (50.80 mm, 101.60 mm)
- Gel pack (50.80 mm, 101.60 mm)
- Film frame - Automated pick & place
- Wafer Map Process Integration on Pick & Place Equipment
- Die Inspection
- Commercial 100X, 100% Visual
- Mil-Std-883 Condition B
- Bump Inspection : Au, Sn / Pb and Lead-Free - Quality Packing & Shipment Services
- Vacuum Sealed, N2 Purged Shipping Bags
- ESD & Moisture Sensitive Packing Materials
- Drop Shipment to End-Customer is Available - Full Factory Quality Certification
- ISO-9000, QS-9000, PQA, ISO-14001
Equipment:
- Olympus MX50 High Power Scopes
- Takatori ATM 8200 Auto Mounter Systems
- Disco DFD 651 Auto Dicing Machines
- Viking 1046 Auto PnP Machines
- Apollo 9200HT Auto PnP Machines
- Viking 1010D Manual Die Sep Machines
- Muhlbauer DS8000 Machines
- Seko Sealer Machines
- Sato Barcode Printers
Process Highlights:
| Wafer thickness (max) | 35 mils |
|---|---|
| Wafer thinning | to 9 mils minimum |
| Die inspection | Commercial, Mil-Std-883 Condition B |
| Wafer mapping | ALPS format compatible |
| Taping standards | IEC 60286-3, EIA-747, EIA-481, EIA-726 |
| Final visual gate | LTPD 5/0 |
| Shipping options | Pocket tape, Waffle pack, Gel Pack, Film Frame |
| Standard shipping reel diameters | 7" (2.25" hub), 13" (4" hub) |
For more information on our Die Processing and Die Inspection services, please contact an Amkor Regional Sales Office near you or fill out the Request for Information Form.
