Amkor's IC Test Development centers provide cost effective, complete semiconductor test solutions and engineering services ranging from: project management, test programs, hardware / contacting, characterization, supporting customer’s prototyping / sampling needs and production ramp.

Amkor has an extensive team of senior test engineers with experience in mixed-signal, memory, high-end digital, power management and RF. Amkor also offers expertise in defining test strategies on complex products with distributed test flows and can assist in development of test specifications.

Why IC Test Development with Amkor?

  • Reduces opportunity cost - extends test software / hardware & product engineering
    • Low cost, robust solutions with high first pass yield
  • "One stop shop" - ownership / accountability
  • Complete technology linkage
    • Advanced bump & packaging + precision - contacting / handling / probing
    • “Tight” co-location & complete program management
  • 3 development centers ( US, Korea & Philippines ) – one project process
    • Support from multiple ATE companies


Typical Solutions:

  • Advanced Wafer Probe
  • Low cost RF probe
  • Hardware (Contactor, Load board, Probe card, Handler Kits) Robust contacting solutions aligned with Amkor's bump & package roadmap
  • Novel test solution for low cost, bottom PoP (package-on-package)
  • SiP Module Test Strategies (including in-line test)
  • Automation of System Level Test solutions
  • Program Conversion
  • Multi Site Test
  • Strip test for punch and saw devices (low mix / high volume)


Examples of Full IC Test Solutions Developed by Amkor

Communications:
  • GPS, DVB-H, T-DMB, ISDBT receivers, demods, base bands, SiP, SCSP
  • Dual sided PoP (package on package) contactors, 2G / 3G baseband
  • Advanced media processor SoC(s)
  • Quadsite celluar Tx front end SiP modules
  • GPS receiver and baseband
  • BlueTooth SoC radio RF probe – WLCSP die sales
  • Multiple die / System in Package solutions for OEMs
  • Cellular power amplifier + transceiver modules, SiP, HEDGE
  • LNA , Video Amplifiers & Drivers
  • Noise cancellation

Consumer:
  • Biometric sensors, MEMS, Quad site fingerprint sensor
  • x16 Power FET & Op Amp solutions
  • MOSFET strip test
  • x32 Memory Card solutions
  • LVDS timing controller  LCD/PDP display
  • Image stabilizer & processors, digital still camera (DSC)
  • USB2.0  / MP3 processor
  • Hard disc controller
  • Microcontrollers
  • Compass IC
  • Optical mouse sensor
  • Power management, chargers / charging, control and filtering / conditioning

 

Amkor IC Test Development Engineers Support a Wide Variety of ATE Platforms

 
ATE Mixed Signal RF Digital Memory
Verigy 93000 x x x  
Advantest T2000 x x x  
Teradyne Flex & UltraFlex x x x  
Teradyne Catalyst x x x  
Teradyne J750 x   x  
LTX, CX & MX x x    
Credence ASL3K, ASL1K x x    
Eagle 364 x      
Teradyne NexTest Maverick     x  
Teradyne NexTest Magnum       x
Amkor RFT   x    
LT / Duo / Quartet x   x  


Test Development overview


For more information and a presentation on Amkor's Test Development Services, please contact an Amkor Regional Sales Office near you or fill out a Request for Information.

Test Services