Amkor has years of High Volume Manufacturing (HVM) experience using a high density, pre-singulated test process for many of the semiconductor industry's most common IC packages. By utilizing Amkor's highest density leadframe (XDLF) assembly process, we are able to achieve high parallelism, up to 300 units per touch down, and throughput, thereby reducing the overall cost of test. Small outline and low lead count packages in high volume are the optimum product type for this process. The industry's acceptance of Amkor's strip test solution is evidenced by the tremendous growth in volume. Since 2000 Amkor continues to be the industry leader in strip test.
Strip test performs the final electrical verification while packages are still together in a leadframe format. Prior to performing strip test, the devices are electrically isolated. Then, following the test process, traditional end-of-line operations occur, including mark, device singulation, vision sort, tape & reel, pack and ship.
The industry's acceptance of Amkor's strip test solution is evidenced by the tremendous growth in volume. Since 2000 Amkor continues to be the leader in strip test.