Amkor’s advanced wafer probe and inspection services support: high speed digital using direct docking, known good die (KGD), thin wafers, Wafer Level Packaging (WLP), temperature and RF probe. For lower cost / higher parallelism our probers support up to 300 to 400Kg of probe force required for multi-site probe. Amkor probe is participating in the leading wafer process nodes across major market segments. Here are a few highlights:
Our portfolio of wafer probers supports -55°C to +200°C probe temperatures, fine alignment and thin wafers:
Amkor uses a wide range of probe card technologies well aligned with advanced wafer process nodes and Amkor’s bump and pillar roadmap.