Amkor has been performing RF probe since 2004. Test solutions include Amkor developed and customer provided. For today’s multi die packages such as Stacked CSP (SCSP) or System in Package (SiP) – having RF probe to source known tested die (KTD) and known good die (KGD) are critical to overall system yield. Also in today’s environment the need has arisen for RF die / RF WLCSP sales – where KGD) is a must. Our RF probe capabilities are also well positioned for emerging TSV (through silicon via) and 3D package trends.

Amkor’s wafer prober portfolio supports 200mm & 300mm, thick and ultra-thin (<150um) wafers, as well as, test temperatures from -55C to +150C. We also offer / support a broad range of industry standard RF ATE equipment and we support automation of system level testers as well.
In addition to RF probe service, Amkor has broad experience in RF final test including a broad range of industry standard ATE equipment (LTX / Credence, Teradyne, Verigy), our own RFT tester and most recently automation of system level test for 802.11 WiFi and 3G cellular modules (LitePoint, R&S and Agilent). Some recent examples of RF test development include:
For more information on our RF Wafer Probe Test Development services, please contact an Amkor Regional Sales Office near you or fill out the Request for Information Form.