Amkor offers a world class full turn-key solution for outsourcing your assembly and test value chain activities.  This enables our customers to focus on their internal core competencies while reducing costs and improving performance which is critical to achieving strategic and financial business success.

At Amkor, we have the ability to take our customers’ product from prototype to mass production in an array of market segments including computing, wireless, communications, storage, consumer, commercial, industrial, medical, defense and automotive.  Amkor strives to provide the lowest cost of ownership through the development of industry leading test, process improvement and total quality management.  Our factories have been awarded the highest international quality and environmental certifications.  We are ready to meet the needs of your outsourcing high volume test requirements.

Amkor Final Test Services

Amkor offers advanced high volume final test production services at our factories in China, Japan, Philippines, Singapore, South Korea and Taiwan.  Our large global presence gives our customers a competitive advantage by lowering manufacturing costs.  Our world class test engineering resources within the factories provide our customers with the required support for the most complex devices.

• High volume production final test
• Full temperature testing capabilities
• Yield and capacity analysis
• Highly skilled factory test engineering support
• Wide range of test and handling equipment
• Custom test processing - Commercial / Military flows and mark after tests
• High volume strip test

Amkor Wafer Probe Services:

Amkor offers an extensive portfolio for wafer probe as part of our full turn-key services for outsourcing your value add activities.  Our ability to offer a one-stop-shop simplifies your manufacturing processes and reduces supply chain management activities. 

• High volume production test for 300mm, 200mm and 150mm wafers
• Full temperature range (-55oC to +150oC)
• Thin wafer handling capabilities (<150um)
• RF probe capabalities
• DPS (Die processing services)
• Clean room environment
• Multi-site probe
• Probe card repair capabilities
• Bake retention
• Bumped wafer probe
• Electronic Assembly Support:
  
  • Die attach wafer mapping (ALPS)
  • Edge dies exclusion 
  • Wafer map template generation
  • Inkless probe
  • Probe wafer mapping

Amkor Test Development Services

Amkor test development centers provide complete engineering services from program development, full product characterization to production ramp. Amkor has an extensive team of highly skilled test engineers with experience in mixed-signal, memory, high-end digital, power management and RF. Reliability and prototype production testing are also supported in these development centers. Amkor also offers expertise in defining test strategies for lowest overall cost and can assist in development of test specifications.

• Project management process(s)
• Rapid first article development
• Advanced wafer probe
• Low cost RF probe
• Hardware (contactor, load board, probe card, handler kits)
• Robust contacting solutions aligned with Amkor's bump and package roadmap
• Novel test solution for low cost, bottom PoP (Package-on-Package)
• SiP module test strategies (including in-line test)
• Automation of system level test solutions
• Program conversion
• Multi-site test
• Strip test for punch and saw devices (low mix / high volume)

For more information on our IC Test Services services, please contact an Amkor Regional Sales Office near you or fill out the Request for Information Form.