Amkor's Power Small Outline Package, PowerSOP® (PSOP3) is a leadframe based, plastic encapsulated package that is well suited for applications requiring optimum performance in IC packaging. This industry standard package utilizes a thick copper heat slug to accommodate the needs of higher power devices. A green BOM is standard, allowing devices to meet applicable Pb free and RoHS standards.

Services and Support:

Amkor has a broad base of resources available to help our customers bring quality new products to market quickly and at the lowest possible cost.

  • PSOP 3Custom leadframe designs
  • Full package characterization
  • Thermal, mechanical stress, and electrical performance modeling
  • Turnkey assembly, test and drop ship
  • World class reliability testing and failure analysis


PSOP New Developments:

  • Stealth dicing (narrow saw streets)
  • Leadframe roughening for improved MSL capability


PSOP Features:

  • Cu wire interconnect for low cost
  • Standard JEDEC package outline
  • Multi-die production capability
  • Turnkey test services
  • Green materials are standard - Pb free and RoHS compliant
  • Theta JC of under 1° C/W can be achieved with optimal heatsinking
  • Highly conductive copper heat-slug and leadframes
  • PSOP3 has optional soft solder die attach for enhanced power capability

 

PSOP Thermal Performance:

Forced Convection, Single-Layer PCB; Theta JA (°C/W) by Velocity (LFPM)

Pkg Body Size (mm) S / NS
0 200 500
20 ld 5.1 x 5.1 S 50.8
35.7
27.8
20 ld 5.1 x 5.1 NS 52.4
37.6
28.8

 

Forced Convection, Multi-Layer PCB;Theta JA (°C/W) by Velocity (LFPM)

Pkg Body Size (mm) S / NS
0 200 500
20 ld 5.1 x 5.1
S 19.2 14.2 12.2
20 ld 5.1 x 5.1
NS 25.7 20.4 17.8


JEDEC Standard Test Boards: S = Slug soldered to test board; NS = Slug NOT soldered to test board

PSOP Electrical Performance:

Simulated Results @ 100MHz
Pkg Body Size (mm) Pad Size
(mm)
Lead Inductance
(nH)
Capacitance
(pF)
Resistance
(mΩ)
20 ld 11 x 15.9
7.5 x 7.9
Longest 3.130 1.990
30.6
20 ld 11 x 15.9 7.5 x 7.9Shortest 1.540
0.604
9.42

 

PSOP Reliability Qualification:

Amkor package qualification uses three independent production lots and a minimum of 77 units per test group. All testing includes JSTD-020 moisture preconditioning.

MSL:   JEDEC Level 3, 30°C / 60% RH, 192 hrs
uHAST:   130°C / 85% RH, No Bias, 96 hours
Temp cycle:   -65 / 150°C, 500 cycles
 HTS  150°C, 1000 hours

 

Process Highlights:

  • Cu wire bonding standard
  • Wafer backgrinding services available
  • Multiple die and die stacking capability
  • NiPdAu (PPF) or Matte Sn lead finish options
  • Laser Mark on package body


Test Services:

Contact Amkor Test Services for more details.

  • Program generation / conversion
  • Wafer probe
  • Burn-in
  • Tape and reel services
  • -55°C to +165°C test available


Shipping:

  • Clear anti-static tube (20 inch)
  • Tape and reel
  • Bar code
  • Dry pack
  • Drop ship

 

PSOP Cross Section:

PSOP 3 cross section

 

PSOP Options

For more information on our PSOP or PSSOP package, please contact an Amkor Regional Sales Office near you or fill out the Request Form.

Packaging



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