A TSSOP (Thin-Shrink Small Outline Package) / MSOP (Micro Small Outline Package) are leadframe based, plastic encapsulated packages that are well suited for pplications requiring less than 1 mm mounted height.
These industry standard packages run in very high volume and provide a value added, low cost solution for a wide range of applications.
A green BOM is standard, allowing devices to meet applicable Pb free and RoHS standards.
TSSOP Services & Support:
Amkor has a broad base of resources available to help our customers bring quality new products to market quickly and at low cost.
- Custom leadframe design
- Full package characterization
- Thermal, mechanical stress, and electrical performance modeling
- Turnkey assembly, test and drop ship
- World class reliability testing and failure analysis
New TSSOP Developments:
- Stealth dicing (narrow saw streets)
- Larger / higher density leadframe strips
- Leadframe roughening for improved MSL capability
TSSOP Features:
- Cu wire interconnect for low cost
- Standard JEDEC package outlines
- Multi-die production capability
- Turnkey test services, including strip test options
- Available in ExposedPad configuration (REF: DS351)
- Green materials are standard - Pb free and RoHS compliant
TSSOP Thermal Performance:
Forced Convection, Single-Layer PCB, JEDEC Standard Test Boards
Theta JA (°C/W) by
Velocity
| Pkg | Body Size (mm) | 0 | 200 | 500 |
|---|---|---|---|---|
| 16 ld | 4.4 x 5.0 | 137.1 | 118.2 | 106.8 |
| 20 ld | 4.4 x 6.5 |
114.5 | 98.0 | 88.0 |
| 28 ld | 6.1 x 9.7 | 82.9 | 68.7 | 60.5 |
| 48 ld | 6.1 x 12.5 | 82.6 | 70.3 | 63.7 |
Forced Convection, Multi-Layer PCB, JEDEC Standard Test Boards
Theta JA (°C/W) by
Velocity
| Pkg | Body Size (mm) | 0 | 200 | 500 |
|---|---|---|---|---|
| 16 ld | 4.4 x 5.0 | 89.0 | 81.8 |
78.1 |
| 20 ld | 4.4 x 6.5 |
73.2 | 66.6 | 63.5 |
| 28 ld | 6.1 x 9.7 | 49.8 | 43.9 | 41.2 |
| 48 ld | 6.1 x 12.5 | 58.3 | 52.3 | 49.9 |
TSSOP / MSOP Reliability Qualification:
Amkor package qualification uses three independent production lots and a minimum of 77 units per test group. All testing includes JSTD-020 moisture preconditioning.
| MSL | JEDEC Level 1, 85°C / 85% RH, 168 hrs |
| MSL | JEDEC Level 3, 30°C / 60% RH, 192 hrs |
| uHAST: | 130°C / 85% RH, No Bias, 96 hours |
| Temp cycle: | -65 / +150°C, 500 cycles |
| High Temp Cycle: | 150°C, 1000 hours |
TSSOP / MSOP Process Highlights:
- Cu wire bonding standard
- Wafer backgrinding services available
- Multiple die and die stacking capability
- NiPdAu (PPF) or Matte Sn lead finish options
- Laser Mark on package body
TSSOP / MSOP Test Services:
- Program generation/conversion
- Wafer probe
- Burn-in
- -55 °C to +165 °C test available
- Strip test available
TSSOP / MSOP Shipping Options:
- Clear anti-static tube, 20 inch
- Tape and reel
- Bar code
- Dry pack
- Drop ship
For more information on the TSSOP / MSOP package or ExposedPad TSSOP package, please contact an Amkor Regional Sales Office near you or fill out the Request Form.