Amkor's tsCSP is a land grid array multi-row package (up to 3 rows of lands) compatible with established CSP mounting processes. The near-chip-size standard outlines of the tsCSP package offer a broad selection of land pitch, count, and body sizes. By utilizing a thin substrate, this package achieves a standard height of 0.4 mm to 0.8 mm Max.

The package uses Amkor's ExposedPad™ technology as a thermal enhancement by having the die attach paddle exposed on the bottom of the package surface to provide an efficient heat path when soldered directly to the PWB. These enhancements also enable stable ground by use of down bonds or by electrical connection through a conductive die attach material.

Regardless of body size and thickness, Amkor tsCSP packages utilize streamlined, flexible manufacturing process to provide economical packaging solutions.

For more information and a product presentation on the Thin Substrate CSP (tsCSP) package, please contact an Amkor Regional Sales Office near you or fill out the Request Form.