Amkor is strategically positioned to deliver world class substrates by maintaining long term procurement agreements with the world’s leading substrate suppliers. As a result, Amkor is able to continuously maintain a fluid, timely supply of 'world class' substrates.
As a leader in packaging innovation, Amkor continues to work collaboratively with its substrate supply base to ensure that all necessary substrate technologies are qualified and available to enable Amkor to deliver the industry's most sophisticated packages. Amkor has a proven track-record in supplier development and product launch.
Additionally, Amkor's highly and uniquely experienced team in substrate technology provides technological guidance to Amkor’s supply base to assist in achieving both internal and external roadmap goals. This is a critical component of Amkor Technology’s success, as Amkor delivers a broad range of packages requiring substrates from the extremely thin and small CSP format up to the very large, sophisticated, high-layer count flip chip package format.
Amkor is committed to not only meeting, but leading the industry in packaged substrate technology.
|"Via² - Laser Embedded Conductor Technology 2008 The 3rd IMPACT and 10th EMAP Joint Conference", White Paper