Amkor is strategically positioned to deliver world class substrates by maintaining long term procurement agreements with the world’s leading substrate suppliers.  As a result, Amkor is able to continuously maintain a fluid, timely supply of substrates.  As a leader in packaging innovation, Amkor continues to work collaboratively with its supply base to ensure that all necessary substrate technologies are available to enable the industry's most sophisticated packages from Amkor. Amkor has a proven track-record in supplier development and product launch.

Additionally, Amkor's highly and uniquely experienced team in substrate technology provides technological guidance to Amkor’s supply base to assist in achieving both internal and external roadmaps. This is a critical component of Amkor Technology’s success, as Amkor delivers a broad range of packages requiring substrates from the extremely thin and small CSP format up to the very large, sophisticated, high-layer count flip chip package format.

For more information on our Substrate Technology, please contact an Amkor Regional Sales Office near you or fill out the Request for Information Form.