A combination of governmental legislation and consumer sentiment has driven the Electronics Industry in general and Semiconductor Packaging specifically to adopt more environmentally friendly materials and processes. Amkor is a leader in the movement towards Green and Pb-Free packaging. All Amkor surface mount products are offered with fully ROHS / Green / Pb-Free compliant options that meet JEDEC package reliability requirements at 260c reflow temperature. Amkor is also a SONY Certified GREEN Partner.
The legislation and directives mainly focus on two issues, the elimination of certain elements and compounds, and the recycling of products at "end of life". For semiconductor assembly it is the elimination of these banned materials (Shown below) that is the primary concern. The two key issues are the removal of lead (Pb) from package terminations, and brominated flame-retarding compounds from encapsulants and substrates. Although not specifically banned, Amkor considers removal of antimony necessary for making a package GREEN.
Partial List of Banned Substances:
|Lead: ||Mercury: ||Cadmium: ||Hexavalent Chromium: ||Poly Brominated Biphenyls: ||Poly Brominated Diphenyl Ethers: |
Amkor Technology Response:
|Material||RoHs: ||Pb-Free: |
|Leadframes|| ||Matte Sn, PPF |
|Die Attach ||Halogen Free || |
|Mold Compound ||Halogen Free || |
|Liquid Encapsulants ||Halogen Free || |
|Underrefill||Halogen Free || |
|Laminate Substrates ||Halogen Free || |
|Solder Balls || ||Pb-Free Solder Balls |
|Solder Bumps || ||Pb-Free Solder Balls |
For more information on our Green / Pb-Free / Leadfree / RoHs Technology Solutions, please contact an Amkor Regional Sales Office near you or fill out the Request for Information Form.