Amkor Technology has been a leader in semiconductor packaging for many years. In the last decade, Amkor has taken the next step forward in packaging and has begun to develop new technologies that enhance and sometimes drastically change the packaging arena.

Amkor believes that new technology will forge new packaging possibilities, thereby enabling the microelectronic world to move swiftly and effortlessly into the future. As technology is advancing more rapidly and consumers are demanding more customization, Amkor is prepared to lead the evolution of those new packaging technologies with one of the strongest R&D teams in the industry today. Amkor employs a staff of over 300 leading semiconductor packaging technologists and is focusing design and development efforts on new technologies that will further advance the value of packaging and lead to total solutions for its customers.

Amkor has been instrumental in the development of almost every new packaging technology advance, including thin package formats and BGA packages. Amkor is now focusing on developing technology such as Through Silicon Via (TSV), Through Mold Via (TMV), System in Package (SiP), Copper  wirebond, Copper (Cu) Pillar, improved interconnect with flip chip technology, and 3D solutions like stacking die and packages. The company has also formed teams focused on the latest industry developments including packaging options for gallium arsenide and silicon germanium, and the emerging markets of optics, microelectromechanical systems (MEMS) and lead-free packaging.