Copper (Cu) wire has long been used as a method of connecting a silicon die to the package terminals. With the recent increase in Gold (Au) wire cost, Copper (Cu) wire is an attractive way to manage overall package cost.

Copper (Cu) Wire Benefits

Copper (Cu) wire offers significant cost advantage over Gold (Au) wire. It is also an excellent replacement for Gold (Au) wire due to its similar electrical properties. Self inductance and self capacitance are nearly the same for Gold (Au) and Copper (Cu) wire and Copper (Cu) wire has lower resistivity. In applications where resistance due to bond wire can negatively impact circuit performance, using Copper (Cu) wire can offer improvement.

Amkor Copper Cu Gold Au Table

 

Wire Material Cost Savings Copper (Cu) versus Gold (Au)

 Amkor Copper Cu versus Gold Au


Minimum Bond Pad Size by Wire Diameter (T = Bond Pad Metal Thickness) 

Copper Wirebond min bond size


Wafer Technology Node and Copper (Cu) Wire Readiness

  > 60nm 55 / 60nm 45 / 40nm
28 / 22nm
Non-Low-K or Low-K    Low-K Low-K Ultra Low-K Ultra Low-K
Reliability Status Customer Qualified    Customer Qualified  
Customer Qualified  
In Process
Production Status
HVM HVM HVM Development 

 

Package Family and Factory Qualification

PACKAGE FAMILY
Cu WIRE HVM PLANT
CABGA C3, K4, P3, J1
LQFP K1, P1, T1, J1
MicroLeadFrame® (MLF)  
C3, K1, P3
MQFP P1, T1
PBGA C3, K4, P3
PDIP
P1
PLCC P1
PSOP P1
SC 70 P1
STACKED CSP (SCSP) C3, K4, J1
SOIC P1
SOT 23
P1
SSOP P1
TQFP K1, P1, T1, J1
TSSOP P1

For more information on our Copper Wire Bonding services, please contact an Amkor Regional Sales Office near you or fill out the Request for Information Form.

Packaging



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