The Common Platform and Amkor Technology

Common Platform LogoChartered, IBM, and Samsung jointly developed the Common Platform, an advanced technology platform based on a leading-edge process technology at 90nm, 65nm and 45nm, and a roadmap to 32nm. With it, a single design can be manufactured at any of the three of fabs. Chartered, IBM and Samsung also collaborates with various EDA, IP and design services partners to offer a comprehensive and open ecosystem that allows customers to share IP and design rules and potentially reduce development costs. In the face of growing chip complexity, Common Platform flexibility can help relieve the worries, expenses and risks of managing design and manufacturing across a range of suppliers such as Amkor Technology.

Amkor Technology, Inc. is one of the world's largest providers of advanced semiconductor assembly and test services. Founded in 1968, Amkor has become a strategic manufacturing partner for many of the world's leading semiconductor companies and electronics OEMs, providing a broad array of advanced package design, assembly and test solutions. Amkor's operational base encompasses more than 5 million square feet of manufacturing facilities, product development centers, and sales & support offices in Asia, Europe and the United States. Amkor offers several Common Platform qualified packages through a suite of services, including electroplated wafer bumping, probe, assembly and final test.

Design Center


Wafer Probe

  • Test software & probe development
  • Digital, analog, mixed-signal, RF, logic & memory test
  • Integrated EDI yield feedback


Wafer Bump

  • Electro-plated wafer bumping
  • Redistribution layer (RDL) technology
  • High volume wafer level packaging
  • Integrated passive construction
  • Solutions for 150mm, 200mm and 300mm


Assembly

  • Turnkey solutions for wirebond and flip chip
  • Broad portfolio of Pb-free and green packages
  • 39 years of Assembly & Test leadership
  • High volume manufacturing in 6 Asian countries
  • Over 5 million square feet of manufacturing space.


Final Test


Logistics and Finished Goods Inventory Management

  • Tape & Reel
  • Dry Pack
  • Warehousing
  • Drop ship to distribution centers in key electronics markets


About the Common Platform

IBM, Chartered and Samsung have broken new ground in the semiconductor industry with a unique collaboration focused on leading-edge, jointly developed digital CMOS process technologies and advanced manufacturing. As a result of the involvement of IDMs, systems companies, and foundries, the jointly developed processes bring a new level of system and application understanding to the silicon process.  The Common Platform model is supported by a comprehensive ecosystem of design enablement and implementation partners from the EDA, IP, and design services industries. Common Platform technology features 90nm, 65nm, 45nm and 32nm process technologies developed as part of a collaboration between IBM, Chartered, Samsung and Infineon.  Freescale has recently joined in the joint process development alliance (JDA) for the 45nm & 32nm technology nodes.

Click here for more information on the Common Platform.

Common Platform Partners:
Chartered – www.charteredsemi.com
IBM – www.ibm.com
Samsung Electronics – www.samsung.com

 

For more information on Amkor and the Common Platform, please contact the Amkor Regional Sales Office near you or fill out a Request Form.

Packaging



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