Amkor's VisionPak Leadless Chip Carrier (LCC) design offers a high temperature co-fired ceramic (HTCC) ceramic substrate with an optically clear lid. Assembly features fully automated UV epoxy dispensing and precision glass placement, providing the accuracy required in image capture applications.

The VisionPak standard footprint is a CLCC with 0.2 mm castellations. Open tools are available in various body sizes. In addition, VisionPak can also be provided in a similar outline in an LGA format. Amkor's manufacturing line uses advanced assembly technology in a state-of-the-art Class 100 clean room with raised floor to minimize particulate contamination of the image sensor.

The VisionPak LCC offers a cost-saving alternative featuring matrix assembly, quick cure die attach with the same advanced assembly, test and precision die and glass placement.

For more information on the VisionPak LCC package, please contact an Amkor Regional Sales Office near you or fill out the Request Form.