A TSSOP (thin-shrink small outline package) is a rectangular, thin body
size surface mount component. A Type I
TSSOP has leads protruding from the width portion of the package. A Type II
TSSOP has the leads protruding from the length portion of the package. With the evolution of smaller, denser, faster and lighter end products, Amkor not only shrunk the SOP by decreasing the lead pitch, but also made it thin - 0.9 mm thin! Amkor invested time and research into assuring quality and reliability with advanced designs, assembly equipment / processes and materials. The result is controlled package flatness wire sweep, solderability and delamination resistance.
Amkor now makes it possible for IC designers, packaging engineers, circuit designers and component specifiers to work concurrently and succeed with its TSSOP product line.
TSSOP Applications:
These IC packages are particularly suited for gate drivers, controllers, wireless / RF, op amps, logic, analog, ASICs, memory (EPROM, E2PROM), comparators and optoelectronics. Memory modules, disk drives, recordable optical disks, telephone handsets, speed dialers, video / audio and consumer electronics / appliances are suggested uses for TSSOP packaging.
TSSOP Features:
TSSOP from Amkor’s product portfolio presents:
- 8 to 80 lead counts
- 3.0 mm, 4.4 mm and 6.1 mm body sizes
- Max. length: 17.0 mm (80L) / Min. length: 3.0 mm (8L)
- 0.9 mm body thickness for 4.4 & 6.1 mm body
- 0.85 mm body thickness for 3.0 mm body
- Lead Pitch: 0.40 - 0.65 mm
- JEDEC package outline standard MO-153 / MO-187 / MO-194
- Hi-conductivity copper leadframes
- Stress mold compound
- Pre-plated Lead Frame (PPF) available for all TSSOP lead counts
- Multi-Die production; 2 - 4 dies, side by side
- Strip Test available for HDLF strips
- Available in ePad Productions
- Pb free, RoHS compliant and Green materials are standard
TSSOP Thermal Resistance:
Forced Convection, Single-Layer PCB, JEDEC Standard Test Boards
Theta JA (°C/W) by
Velocity
| Pkg | Body Size (mm) | 0 | 200 | 500 |
|---|---|---|---|---|
| 16 ld | 5.0 x 4.4 | 137.1 | 118.2 | 106.8 |
| 20 ld | 6.5 x 4.4 | 114.5 | 98.0 | 88.0 |
| 28 ld | 9.7 x 6.1 | 82.9 | 68.7 | 60.5 |
| 48 ld | 12.5 x 16.1 | 82.6 | 70.3 | 63.7 |
TSSOP Reliability:
Amkor subjects their TSSOP packages to high level testing to assure reliable performance.
| HAST: | 130°C / 85% RH, No Bias, 96 hours |
| Temp cycle: | -65 / +150°C, 500 cycles |
| HTS: | 150°C, 1000 hours |
TSSOP Additional Information:
Process Highlights:
| Die Thickness (max): | 10.5-11.5 mil (4.4 & 6.1 mm body) 7.5-8.5 mil (3.0 mm body) |
| Lead plating: | Matte Sn or NiPdAu (PPF) |
| Package Marking: | Laser |
| Pack / ship options: | Bar code / dry pack / TNR |
| Wafer backgrinding: | Available |
Test Services:
Contact Amkor Test Services for more details.
- Program generation / conversion
- Product engineering support
- Wafer sort
- Ambient to +165°C test available
- Tape and reel services
- Burn-in available
- Strip Test
Shipping:
- Clear anti-static tube (20 inch)
For more information on the TSSOP / QSOP package or ExposedPad TSSOP package, please contact an Amkor Regional Sales Office near you or fill out the Request Form.