Amkor's TSOP is a leadframe based, plastic encapsulated package that is well suited for memory products, including SRAM, FLASH, FSRAM, and EEPROMs. A green BOM is standard, allowing devices to meet applicable Pb-free and RoHS standards.
Amkor has a broad base of resources available to help customers bring new products to market quickly and at the lowest possible cost.
- Design services, including custom leadframes
- Package characterization and modeling
- Turnkey assembly, test and drop ship
Amkor’s TSOP packages offer:
- Cu wire interconnect for low cost
- Standard JEDEC package outlines
- Enhanced design for memory applications
- Stacked die up to 4X, including stair step and film-over wire (FOW) construction
- Green materials are standard - Pb free & RoHS compliant
- Turnkey test services, including strip test options
TSOP Thermal Resistance:
Forced Convection, Single-Layer PCB, JEDEC Standard Test Boards
Theta JA (°C/W) by Velocity
| Pkg | Body Size (mm) | 0 | 200 | 500 |
|---|---|---|---|---|
| 32 ld | 8 x 14 | 85.2 | 66.6 | 58.5 |
| 40 ld | 10 x 20 | 75.0 | 57.2 | 48.6 |
| 48 ld | 12 x 20 | 80.1 | 62.4 | 54.2 |
Forced Convection, Multi-Layer PCB, JEDEC Standard Test Boards
Theta JA (°C/W) by Velocity
| Pkg | Body Size (mm) | 0 | 200 | 500 |
|---|---|---|---|---|
| 32 ld | 8 x 14 | 53.2 | 46.4 | 43.0 |
| 40 ld | 10 x 20 | 44.6 | 37.6 | 34.2 |
| 48 ld | 12 x 20 | 50.8 | 43.7 | 40.0 |
TSOP Reliability Qualification:
Amkor package qualification uses three independent production lots and a minimum of 77 units per test group. All testing includes JSTD-020 moisture preconditioning.
| MSL: | JEDEC Level 3, 30°C / 60% RH, 192 hrs |
|---|---|
| uHAST: | 130°C / 85% RH, No Bias, 96 hours |
| Temp Cycle: | -65°C / +150°C, 500 cycles |
| High Temp Storage: | 150°C, 1000 hours |
TSOP Process Highlights:
- Wafer backgrinding services available
- Multiple die and die stacking capability
- Optional Chip-On-Lead (COL) construction using film die attach material and Inner Lead Trace (ILT) leadframes
- Matte Sn leadfinish is standard
- Laser marking on package body
Shipping Options:
- JEDEC outline CS-020 low profile tray
- Bar code
- Dry pack
- Drop ship
Test Services:
- Program generation/conversion
- Wafer probe
- Burn-in
- -55°C to +165°C test available
STACKED TSOP Cross Section:
TSOP Cross Section:
TSOP Configuration Options:
For more information on the TSOP package, please contact an Amkor Regional Sales Office near you or fill out the Request Form.