Amkor's TSOP is a leadframe based, plastic encapsulated package that is well suited for memory products, including SRAM, FLASH, FSRAM, and EEPROMs. A green BOM is standard, allowing devices to meet applicable Pb-free and RoHS standards.

Amkor has a broad base of resources available to help customers bring new products to market quickly and at the lowest possible cost.

  • Design services, including custom leadframes
  • Package characterization and modeling
  • Turnkey assembly, test and drop ship

Amkor’s TSOP packages offer:

  • Cu or Ag wire interconnect for low cost
  • Standard JEDEC package outlines 
  • Enhanced design for memory applications
  • Stacked die up to 4X, including stair step and film-over wire (FOW) construction
  • Green materials are standard - Pb free & RoHS compliant
  • Turnkey test services, including strip test options

TSOP Thermal Resistance:

Forced Convection, Single-Layer PCB, JEDEC Standard Test Boards
Theta JA (°C/W) by Velocity

Pkg Body Size (mm) 0 200 500
32 ld 8 x 14 85.2 66.6 58.5
40 ld 10 x 20 75.0 57.2 48.6
48 ld 12 x 20 80.1 62.4 54.2


Forced Convection, Multi-Layer PCB, JEDEC Standard Test Boards
Theta JA (°C/W) by Velocity

Pkg Body Size (mm) 0 200 500
32 ld 8 x 14 53.2 46.4 43.0
40 ld 10 x 20 44.6 37.6 34.2
48 ld 12 x 20 50.8 43.7 40.0


TSOP Reliability Qualification:

Amkor package qualification uses three independent production lots and a minimum of 77 units per test group. All testing includes JSTD-020 moisture preconditioning.

MSL:   JEDEC Level 3, 30°C / 60% RH, 192 hrs
uHAST:   130°C / 85% RH, No Bias, 96 hours
Temp Cycle:   -65°C / +150°C, 500 cycles
High Temp Storage:
  150°C, 1000 hours


TSOP Process Highlights:

  • Wafer backgrinding services available
  • Multiple die and die stacking capability
  • Optional Chip-On-Lead (COL) construction using film die attach material and Inner Lead Trace (ILT) leadframes
  • Matte Sn leadfinish is standard
  • Laser marking on package body

Shipping Options:

  • JEDEC outline CS-020 low profile tray
  • Bar code
  • Dry pack
  • Drop ship


Test Services:

  • Program generation/conversion
  • Wafer probe
  • Burn-in
  • -55°C to +165°C test available

STACKED TSOP Cross Section:

Stacked TSOP Cross Section


TSOP Cross Section:

TSOP Cross Section


TSOP Configuration Options:

tsop configurations

For more information on the TSOP package, please contact an Amkor Regional Sales Office near you or fill out the Request Form


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