Amkor's tsCSP (Thin Substrate CSP) is a land grid array multi-row package (up to 3 rows of lands) compatible with established CSP mounting processes. The near-chip-size standard outlines of the tsCSP package offer a broad selection of land pitch, count, and body sizes. By utilizing a thin substrate, this package achieves a standard height of 0.4 mm to 0.8 mm Max.
The package uses Amkor's ExposedPad technology as a thermal enhancement by having the die attach paddle exposed on the bottom of the package surface to provide an efficient heat path when soldered directly to the PWB. These enhancements also enable stable ground by use of down bonds or by electrical connection through a conductive die attach material.
Regardless of body size and thickness, Amkor tsCSP packages utilize streamlined, flexible manufacturing process to provide economical packaging solutions.
Amkor’s tsCSP package is an ideal choice for handheld portable
devices such as cell phones and PDAs or other applications requiring
small size, light weight, excellent thermal and electrical performance,
and low cost.
Typical device applications for Amkor's tsCSP package include hard disk drives, USB controllers, wireless LAN, memory, analog, ASICs, RF devices and simple PLDs.
Values dependant on specific die and wire configurations
|Package Size (mm)||I/O Count||(nH)||(pF)||(mOhm)|
|12 x 12||172 (corner)||4.22||0.286||217.2|
|12 x 12||172 (center)||3.04||0.264||173.5|
JEDEC Multi-layer PCB; Modeled data @ 0 air flow and 1W power
|Package Size (mm)||I/O Count||Exposed Pad (mm)||Die (mm)||Theta JA (°C/W)|
|15 x 15||208||11.6 x 11.6||9.3 x 9.3||19.4|
|10 x 10||200||5.8 x 5.8||5.29 x 5.29||24.9|
|7 x 7||92||3.8 x 3.8||3.29 x 3.29||33.6|
|4 x 4||28||1.7 x 1.7||1.29 x 1.29||57.5|
Amkor’s tsCSP packages are reliability assured through optimized design, material and process.
|Moisture sensitivity characterization:||JEDEC Level 1 (depending on body size) 85 °C / 85%, 168 hours|
|HAST:||130°C, 85% RH, 96 hours|
|High temperature storage:||150°C, 1000 hours|
|Temp cycle:||-65 / +150°C, 1000 cycles|
|Die Thickness:||.25 ± .05 nominal|
|Plating:||Au / Ni|
|Substrate:||Plate-up coreless technology, Au / Ni/ Cu|
|Die attach:||Conductive Epoxy|
|Wire:||1.0 mil low loop|
|Mold compound:||Pb free / GreenCapable|