Very Thin, Superior Performance, Cost Effective
Amkor's tsCSP (Thin Substrate CSP) is a land grid array multi-row package (up to 3 rows of lands) compatible with established CSP mounting processes. The near-chip-size standard outlines of the tsCSP package offer a broad selection of land pitch, count, and body sizes. By utilizing a thin substrate, this package achieves a standard height of 0.4 mm to 0.8 mm Max.
The package uses Amkor's ExposedPad technology as a thermal enhancement by having the die attach paddle exposed on the bottom of the package surface to provide an efficient heat path when soldered directly to the PWB. These enhancements also enable stable ground by use of down bonds or by electrical connection through a conductive die attach material.
Regardless of body size and thickness, Amkor tsCSP packages utilize streamlined, flexible manufacturing process to provide economical packaging solutions.
tsCSP Applications:
Amkor’s tsCSP package is an ideal choice for handheld portable
devices such as cell phones and PDAs or other applications requiring
small size, light weight, excellent thermal and electrical performance,
and low cost.
Typical device applications for Amkor's tsCSP
package include hard disk drives, USB controllers, wireless LAN, memory,
analog, ASICs, RF devices and simple PLDs.
tsCSP Package Features:
- Low NRE cost
- Square or rectangle packages available
- Body sizes less than 2mm SQ and up to 15mm SQ (Qualification required for larger body sizes)
- Ultra thin: 0.35mm to 0.75mm nominal package profile
- High I/O density: 0.5mm, 0.4mm land pitch
- Isolated Power / Ground ring option
- Strip testing capabilities
- No antenna effect for high speed devices
- High MSL performance (L1 / 260 MSL) (Depending on body size)
- Exposed die attach pad for superior thermal performance
- No die attach pad for additional routing under die
- JEDEC MO-247 compliant: Plastic Quad No-lead Staggered Multi-row Packages
- JEDEC Publication 95 Design Guide 4.19 complaint: Quad No-lead Staggered and Inline Multi-row Packages
- Standard Pb Free and Green package
tsCSP Electrical Simulation:
Values dependant on specific die and wire configurations
| Package Size (mm) | I/O Count | (nH) | (pF) | (mOhm) |
|---|---|---|---|---|
| 12 x 12 | 172 (corner) | 4.22 | 0.286 | 217.2 |
| 12 x 12 | 172 (center) | 3.04 | 0.264 | 173.5 |
Thermal Resistance:
JEDEC Multi-layer PCB; Modeled data @ 0 air flow and 1W power
| Package Size (mm) | I/O Count | Exposed Pad (mm) | Die (mm) | Theta JA (°C/W) |
|---|---|---|---|---|
| 15 x 15 | 208 | 11.6 x 11.6 | 9.3 x 9.3 | 19.4 |
| 10 x 10 | 200 | 5.8 x 5.8 | 5.29 x 5.29 | 24.9 |
| 7 x 7 | 92 | 3.8 x 3.8 | 3.29 x 3.29 | 33.6 |
| 4 x 4 | 28 | 1.7 x 1.7 | 1.29 x 1.29 | 57.5 |
tsCSP Reliability:
Amkor’s tsCSP packages are reliability assured through optimized design, material and process.
| Moisture sensitivity characterization: | JEDEC Level 1 (depending on body size) 85 °C / 85%, 168 hours |
| HAST: | 130°C, 85% RH, 96 hours |
| High temperature storage: | 150°C, 1000 hours |
| Temp cycle: | -65 / +150°C, 1000 cycles |
Process Highlights:
| Die Thickness: | .25 ± .05 nominal |
| Plating: | Au / Ni |
| Marking: | Laser |
Standard Materials:
| Substrate: | Plate-up coreless technology, Au / Ni/ Cu |
| Die attach: | Conductive Epoxy |
| Wire: | 1.0 mil low loop |
| Mold compound: | Pb free / GreenCapable |
Test Services:
- Program generation / conversion
- Product engineering support
- Available test / handling technology
- Tape and Reel Services
- Burn-in capabilities
Shipping:
This product is shipped in clear anti-static tubes, bakable trays or metal canisters.
tsCSP Cross Sections:
For more information and a product presentation on the Thin Substrate CSP (tsCSP) package, please contact an Amkor Regional Sales Office near you or fill out the Request Form.