TO-92 is a leadframe based, plastic encapsulated package that is well suited for applications requiring optimum performance in transistor packaging.
The Transistor Outline (TO-92) is a leadframe based, plastic encapsulated package that is well suited for applications requiring optimum performance in transistor packaging. TO-92 industry standard through-hole package is readily adaptable for use in automatic insertion equipment. The small foot print is designed to save board space while providing high volume and value added, low cost solutions for a wide range of applications. A green BOM is standard, allowing devices to meet applicable Pb free and RoHS standards.
Amkor package qualification uses three independent production lots and a minimum of 77 units per test group. All testing includes JSTD-020 moisture preconditioning.
Amkor has a broad base of resources available to help our customers bring quality new products to market quickly and at the lowest possible cost.
imulated results @ at 100 MHz
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