Amkor's SuperFC® (Super Flip Chip / FCBGA / Flip Chip BGA) is THE high performance flip chip solution. Flip chip interconnect utilizes array interconnect of die to substrate as a replacement for conventional wire bonding. This allows the entire die surface to be used for electrical connections to the substrate, exponentially increasing the I / O per unit area vs. perimeter interconnect technologies. Implementing process technology licensed from industry leader LSI logic, Amkor’s SuperFC® package uses solder bump flip chip interconnect and can route over 1000 signal traces from a single die out to a 1.0 mm pitch BGA footprint.

SuperFC® packages are assembled around state-of-the-art laminate substrates. Utilizing multi-layer, blind and buried vias, laser drilled build up structures, and ultrafine line / space metallization, Super Flip Chip has the highest routing density available. Using flip chip interconnect automatically improves package electrical performance by removing the high inductance wires and replacing them with low inductance solder connections. By combining flip chip with ultra advanced substrate technology, packages can be electrically tuned for maximum electrical performance. Amkor has qualified packages using high Tg epoxy as dielectric materials, to provide the maximum flexibility in package price / performance offerings.

For more information on the SuperFC (Super Flip Chip / Flip Chip BGA / FCBGA) package, please contact an Amkor Regional Sales Office near you or fill out the Request Form.