The SuperBGA^® (SBGA) technology provides a very low profile, high-power BGA package. The IC is directly attached to an integrated copper heatsink. Since the IC and I/O are on the same side, signal vias are eliminated, providing a significant improvement in electrical performance (inductance). SBGAs are available in a broad line of ball (I/O) counts and standard JEDEC body sizes which are supported by an industry infrastructure (sockets, trays, etc). SuperBGA^®'s utilize advanced substrate designs with proven assembly practices and materials to assure your IC complementary performance.

Our Tape-SuperBGA technology combines SBGA thermal performance with the benefits of one metal layer flexible circuit tape. Like the SBGA package, Tape-SBGA offers a high-power solution for design engineers with the additional benefits of low profile and cost effectiveness in a cavity down package.

For more information on the SuperBGA® package, please contact an Amkor Regional Sales Office near you, your Account Manager or fill out the Request Form.