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SSOP (Shrink Small Outline) & QSOP (Quarter-Size Small Outline) are leadframe based, plastic encapsulated packages that are well suited for applications requiring optimum performance in IC packaging with applications requiring compressed body size and tightened lead pitch. These industry standard IC packages yield a significant reduction in size while running in high volume and provide value added low cost solutions for a wide range of applications. A green BOM is standard, allowing devices to meet applicable Pb free and RoHS standards.

SSOP / QSOP Services and Support:

Amkor has a broad base of resources available to help our customers bring quality new products to market quickly and at the lowest possible cost.

  • SSOP / QSOPCustom leadframes
  • Full package characterization
  • Thermal, Mechanical and Stress and Electrical performance modeling
  • Turnkey assembly, test and drop ship
  • World class Reliability testing and Failure analysis


SSOP / QSOP New Developments:

  • Stealth dicing (narrow saw streets)
  • Larger / Higher Density leadframe strips
  • Leadframe roughening for improved MSL capability


SSOP / QSOP Features:

Amkor’s SSOP package portfolio provides:

  • Cu wire interconnect for lowest cost
  • Standard JEDEC package outlines
  • Multi-die production capability
  • Turnkey test services, including Strip Test options
  • Available in ExposedPad configuration (DS 571)
  • Green materials are standard - Pb free and RoHS compliant


SSOP / QSOP Thermal Resistance:

Multi-Layer PCB, JEDEC Standard Test Boards

Theta JA (°C/W) by Velocity

Pkg> Body Size (mm)> Pad Size (mm)> 0> 200> 500>
20 ld 3.9 x 8.7 2.4 x 3.6 80.8 73.2 69.2
28 ld 5.3 x 10.2 3.84 x 8.10 49.0 36.0 30.0

 

SSOP / QSOP Electrical:

Simulated Results @ 100 MHz

Pkg Body Size (mm) Pad Size (mm) Lead Inductance (nH) Capacitance (pF) Resistance (mOmega)
20 ld 5.3 x 7.2 3.9 x 5.4 Longest 2.260 0.395 19.0
20 ld 5.3 x 7.2 3.9 x 5.4 Shortest 0.958 0.209 9.10
28 ld 3.9 x 9.9 2.4 x 4.8 Longest 1.590 0.376 14.1
28 ld 3.9 x 9.9 2.4 x 4.8 Shortest 0.757 0.198 7.53
28 ld 5.3 x 10.2 3.9 x 5.1 Longest 2.510 0.463 21.5
28 ld 5.3 x 10.2 3.9 x 5.1 Shortest 0.928 0.206 9.57
56 ld 7.5 x 18.4 2.5 x 5.6 Longest 6.410 0.941 47.4
56 ld 7.5 x 18.4 2.5 x 5.6 Shortest 2.490 0.497 23.1

 

SSOP / QSOP Reliability Qualification:

Package reliability is assured for worry-free operation

MSL:  JEDEC Level 1, 85°C / 85% RH, 168 hrs
MSL:  JEDEC Level 3, 30°C / 60% RH, 192 hrs
uHAST:   130 °C / 85% RH, No Bias, 96 hours
High Temp Storage:   150°C, 1000 hours
Temp Cycle:   -65 / +150°C, 500 cycles

 

Process Highlights:

  • Cu wire bonding standard
  • Wafer backgrinding services available
  • Multiple die and die stacking capability
  • NiPdAu (PPF) or Matte Sn lead finish options
  • Laser Mark on package body

Test Service:

Contact Amkor Test Services for more details.

  • Program generation / conversion
  • Wafer Probe
  • Wafer sort
  • Burn-in
  • -55 °C to +165 °C test available
  • Strip test available


Shipping:

  • Clear anti-static tube, 20 inch
  • Tape and reel
  • Bar code
  • Dry pack
  • Drop ship

 

SSOP & QSOP Cross Section:

 

SSOP / QSOP Cross Section
 
 
 

SSOP / QSOP Configurations


For more information on the SSOP / SOP / QSOP package, please contact an Amkor Regional Sales Office near you or fill out the Request Form.

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