How do you reduce an SOP size and its board footprint demand? Amkor did it by
taking a family of SOPs and shrinking them to create the SSOP / MSOP. Shrink small-outline package (SSOP) is a microchip package for SMT and have "gull wing" leads protruding from the two long sides. The SSOP body size was compressed and the
lead pitch tightened to obtain a smaller version SOP. This yields an SSOP IC package
which is a significant reduction in the size (compared to standard package). All
IC assembly processes remain the same as with our standard SOPs. The use of
proven, reliable materials coupled with statistically controlled processes,
assures long term, worry-free operation of your SSOP packages.
SSOP / MSOP Package Applications
These packages enable end-products (portable audio / video, disc drives, radio, RF devices / components, telecom) to be reduced in size and weight. Semiconductor families such as operational amplifiers, drivers, optoelectronics, controllers, logic, analog, memory, comparators and more using BiCMOS, CMOS or other silicon / GaAs technologies are well addressed by Amkor’s SSOP product family.
SSOP / MSOP Package Features
Amkor’s SSOP package portfolio provides:
- 14 to 56 lead counts
- 150, 209 and 300 mil body sizes
- JEDEC and EIAJ package outline standard compliance
- High-conductivity copper leadframes
- Wide selection of die pad sizes
- Broad open-tooled portfolio
- Matte Sn lead finish and NiPdAu (PPF) are available
- Pb free, RoHS compliant and Green materialsare standard
- Strip Test with New Matrix Leadframe
SSOP Thermal Resistance
Multi-Layer PCB, JEDEC Standard Test Boards
Theta JA (°C/W) by Velocity
| Pkg> | Body Size (mm)> | Pad Size (mm)> | 0> | 200> | 500> |
|---|---|---|---|---|---|
| 20 ld | 3.9 x 8.7 | 2.4 x 3.6 | 80.8 | 73.2 | 69.2 |
| 28 ld | 5.3 x 10.2 | 3.84 x 8.10 | 49.0 | 36.0 | 30.0 |
SSOP Electrical
Simulated Results @ 100 MHz
| Pkg | Body Size (mm) | Pad Size (mm) | Lead | Inductance (nH) | Capacitance (pF) | Resistance (mOmega) |
|---|---|---|---|---|---|---|
| 20 ld | 5.3 x 7.2 | 3.9 x 5.4 | Longest | 2.260 | 0.395 | 19.0 |
| 20 ld | 5.3 x 7.2 | 3.9 x 5.4 | Shortest | 0.958 | 0.209 | 9.1 |
| 28 ld | 3.9 x 9.9 | 2.4 x 4.8 | Longest | 1.590 | 0.376 | 14.1 |
| 28 ld | 3.9 x 9.9 | 2.4 x 4.8 | Shortest | 0.757 | 0.198 | 7.53 |
| 28 ld | 5.3 x 10.2 | 3.9 x 5.1 | Longest | 2.510 | 0.463 | 21.5 |
| 28 ld | 5.3 x 10.2 | 3.9 x 5.1 | Shortest | 0.928 | 0.206 | 9.57 |
| 56 ld | 7.5 x 18.4 | 2.5 x 5.6 | Longest | 6.410 | 0.941 | 47.4 |
| 56 ld | 7.5 x 18.4 | 2.5 x 5.6 | Shortest | 2.490 | 0.497 | 23.1 |
SSOP Reliability
Package reliability is assured for worry-free operation
| HAST: | 130 °C / 85% RH, no bias, 96 hours |
| High Temp Storage: | 150°C, 1000 hours |
| Temp Cycle: | -65 / +150°C, 500 cycles |
SSOP Process Highlights
| Die thickness: (Maximum) |
3.9 mm (150 mil) 16 mil 5.3 mm (209 mil) 17 mil 7.5 mm (300 mil) 25 mil |
| Solder plating: | Matte Sn or NiPdAu PPF |
| Marking: | Laser / pad ink |
| Pack / ship options: | Bar code, tube / box, TNR |
SSOP Standard Material (Pb-Free / Green)
| Leadframe Alloy: | C194 |
| Die Attach Material: | Ablebond 8290 |
| Gold Wire: | 0.8 mil diameter |
| Mold Compound: | Sumitomo G600 |
| Lead Finish: | Matte Sn or NiPdAu PPF |
Test Services
Contact Amkor Test Services for more details.
- Program generation / conversion
- Product engineering support
- Wafer sort
- Burn-in available
- Tape and reel services
- Ambient to +165 °C test available
Shipping
- Clear antistatic tube (20 inch)
For more information on the SSOP / SOP / MSOP package, please contact an Amkor Regional Sales Office near you or fill out the Request Form.