Amkor’s 1.0 mm thick, 3, 5, 6, and 8 lead SOT23 and 5 and 6 lead SC70 packages
offer gullwing lead, sub-miniature, SMT performance characteristics. These
packages are high-density leadframe (HDLF) strip-assembled in densities up to
400 units per strip and are processed in an integrated line from die attach
through tape and reel for maximum cost effectiveness.
This Amkor exclusive technology provides a low-cost packaging solution particularly well suited for wireless / RF and analog devices, as well as ultra thin hand-held portable products such as cell phones, data storage systems, and notebook computers.
Amkor subjects their SOT / SC packages to high level testing to assure reliable performance.
| Moisture sensitivity characterization: | JEDEC Level 1, 85 °C / 85%, 168 hrs |
| Un-biased HAST: | 130 °C / +85 °C, 96 hours |
| High temp storage: | +150 °C, 1000 hours |
| Temp cycle: | -65 °C / +150 °C, 500 cycles |
| Die Thickness (max): | 8 mil |
| Marking: | Laser |
| Pack / Ship Options: | Tape & Reel or Bulk |
| Wafer Backgrinding: | Available |
| Wafer Map: | Capable |
| Leadframe Alloy: | Copper (C194) |
| Die Attach Material: | 8290 |
| Gold Wire: | 0.8 mil diameter |
| Mold Compound: | Sumitomo G600 |
| Lead Finish: | 100% Matte Tin |
Contact Amkor Test Services for more details.
For more information on the SOT-23 / SC-70 package, please contact an Amkor Regional Sales Office near you or fill out the Request Form.