SOIC is a leadframe based, plastic encapsulated package that is well suited for applications requiring optimum performance in IC packaging.
This industry standard package runs in very high volume and provides value added, low cost solutions for a wide range of applications. A green Bill Of Materials (BOM) is standard, allowing devices to meet applicable Pb free and RoHS standards.
SOIC Services & Support:
Amkor has a broad base of resources available to help our customers bring quality new products to market quickly and at the lowest possible cost.
- Custom leadframes design
- Full Package characterization
- Thermal, mechanical stress and Electrical performance modeling
- Turnkey assembly, test and drop ship
- World class reliability testing and failure analysis
New SOIC Developments:
- Stealth dicing (narrow saw streets)
- Larger / Higher Density leadframe strips
- Leadframe roughening for improved MSL capability
Amkor’s SOIC packages offer:
- Copper wire interconnect for low cost
- Standard JEDEC package outlines
- Multi-die production capability
- Turnkey test service, including strip test option
- Green materials are standard - Pb Free and RoHS compliant
Thermal Performance:
Forced Convection, Single-Layer PCB, Pre-JEDEC Standard Test Boards
Theta JA (°C/W) by Velocity (LFPM)
| Pkg | Body Size (mm) | Pad Size (mm) | 0 | 200 | 500 |
| 8 ld | 4.9 x 3.8 | 2.3 x 2.3 | 153.3 | 128.5 | 115.5 |
| 20 ld | 12.8 x 7.6 | 5.1 x 4.1 | 83.2 | 65.7 | 57.5 |
| 28 ld | 7.6 x 18.0 | 6.4 x 5.6 | 76.2 | 60.8 | 53.2 |
Forced Convection, Multi-Layer PCB, Pre-JEDEC Standard Test Boards
Theta JA (°C/W) by Velocity (LFPM)
| Pkg | Body Size (mm) | Pad Size (mm) | 0 | 200 | 500 |
| 8 ld | 4.9 x 3.8 | 2.3 x 2.3 | 127.7 | 103.3 | 91.1 |
| 28 ld | 18.0 x 7.6 | 5.6 x 6.4 | 46.2 | 39.7 | 36.8 |
SOIC Reliability Qualification:
Amkor package qualification uses three independent production lots and a minimum of 77 units per test group. All testing includes JSTD-020 moisture preconditioning.
| MSL: | JEDEC Level 1, 85°C / 85% RH, 168 hrs |
| MSL: | JEDEC Level 3, 30°C / 60% RH, 192 hrs |
| Temp cycle: | -65 / +150°C, 500 cycles |
| uHAST: | 130 °C / 85% RH, No Bias, 96 hours |
| High temp storage: | 150°C, 1000 hours |
SOIC Process
Highlights:
- Cu wire bonding standard
- Wafer backgrinding services available
- Multiple die and die stacking capability
- NiPdAu (PPF) or Matte Sn lead finish options
- Laser Mark on package body
SOIC Test Services:
- Program generation / conversion
- Wafer probe
- Burn-in
- -55°C to +165°C test available
- Strip based testing available
SOIC Shipping Options:
- Clear Anti-static tube, 20 inch
- Tape and reel
- Bar code
- Dry pack
- Drop ship
SOIC Configuration Options:
SOIC Nominal Package Dimensions (units in inches)
|
|
Lead Count |
Body Width |
Body Length |
Body Thickness |
Standoff |
Overall Height |
Lead Pitch |
Tip to Tip |
JEDEC |
|
SOIC Narrow |
8 |
0.150 |
0.194 |
0.058 |
0.006 |
0.064 |
0.050 |
0.236 |
MS-012 |
|
14 |
0.150 |
0.342 |
0.058 |
0.006 |
0.064 |
0.050 |
0.236 |
MS-012 |
|
|
16 |
0.150 |
0.391 |
0.058 |
0.006 |
0.064 |
0.050 |
0.236 |
MS-012 |
|
|
SOIC Wide |
8 |
0.208 |
0.208 |
0.071 |
0.004 |
0.075 |
0.050 |
0.311 |
N/A |
|
16 |
0.300 |
0.407 |
0.092 |
0.009 |
0.101 |
0.050 |
0.406 |
MS-013 |
|
|
18 |
0.300 |
0.456 |
0.092 |
0.009 |
0.101 |
0.050 |
0.406 |
MS-013 |
|
|
20 |
0.300 |
0.505 |
0.092 |
0.009 |
0.101 |
0.050 |
0.406 |
MS-013 |
|
|
24 |
0.300 |
0.607 |
0.092 |
0.009 |
0.101 |
0.050 |
0.406 |
MS-013 |
|
|
28 |
0.300 |
0.706 |
0.092 |
0.009 |
0.101 |
0.050 |
0.406 |
MS-013 |
|
|
32 |
0.300 |
0.818 |
0.088 |
0.007 |
0.095 |
0.050 |
0.412 |
MO-119 |
For more information on our SOIC, please contact an Amkor Regional Sales Office near you or fill out the Request Form.