SOIC SOJSOIC is a leadframe based, plastic encapsulated package that is well suited for applications requiring optimum performance in IC packaging.

This industry standard package runs in very high volume and provides value added, low cost solutions for a wide range of applications. A green Bill Of Materials (BOM) is standard, allowing devices to meet applicable Pb free and RoHS standards.

 

SOIC Services & Support:

Amkor has a broad base of resources available to help our customers bring quality new products to market quickly and at the lowest possible cost.


New SOIC Developments:

  • Stealth dicing (narrow saw streets)
  • Larger / Higher Density leadframe strips
  • Leadframe roughening for improved MSL capability


Amkor’s SOIC packages offer:

  • Copper wire interconnect for low cost
  • Standard JEDEC package outlines
  • Multi-die production capability
  • Turnkey test service, including strip test option
  • Green materials are standard - Pb Free and RoHS compliant

 

Thermal Performance:

Forced Convection, Single-Layer PCB, Pre-JEDEC Standard Test Boards

Theta JA (°C/W) by Velocity (LFPM)

Pkg Body Size (mm) Pad Size (mm) 0 200 500
8 ld 4.9 x 3.8 2.3 x 2.3 153.3 128.5 115.5
20 ld 12.8 x 7.6 5.1 x 4.1 83.2 65.7 57.5
28 ld 7.6 x 18.0 6.4 x 5.6 76.2 60.8 53.2

 

Forced Convection, Multi-Layer PCB, Pre-JEDEC Standard Test Boards

Theta JA (°C/W) by Velocity (LFPM)

Pkg Body Size (mm) Pad Size (mm) 0 200 500
8 ld 4.9 x 3.8 2.3 x 2.3 127.7 103.3 91.1
28 ld 18.0 x 7.6 5.6  x 6.4 46.2 39.7 36.8

 

SOIC Reliability Qualification:

Amkor package qualification uses three independent production lots and a minimum of 77 units per test group. All testing includes JSTD-020 moisture preconditioning.

MSL:   JEDEC Level 1, 85°C / 85% RH, 168 hrs
MSL:   JEDEC Level 3, 30°C / 60% RH, 192 hrs
Temp cycle:   -65 / +150°C, 500 cycles
uHAST:   130 °C / 85% RH, No Bias, 96 hours
High temp storage:   150°C, 1000 hours


SOIC Process Highlights:

  • Cu wire bonding standard
  • Wafer backgrinding services available
  • Multiple die and die stacking capability
  • NiPdAu (PPF) or Matte Sn lead finish options
  • Laser Mark on package body


SOIC Test Services:

  • Program generation / conversion
  • Wafer probe
  • Burn-in
  • -55°C to +165°C test available
  • Strip based testing available


SOIC Shipping Options:

  • Clear Anti-static tube, 20 inch
  • Tape and reel
  • Bar code
  • Dry pack
  • Drop ship

 

SOIC Configuration Options:

SOIC Nominal Package Dimensions (units in inches)

 

Lead Count

Body Width

Body Length

Body

Thickness

Standoff

Overall Height

Lead Pitch

Tip to Tip

JEDEC

SOIC

Narrow

8

0.150

0.194

0.058

0.006

0.064

0.050

0.236

MS-012

14

0.150

0.342

0.058

0.006

0.064

0.050

0.236

MS-012

16

0.150

0.391

0.058

0.006

0.064

0.050

0.236

MS-012

SOIC

Wide

8

0.208

0.208

0.071

0.004

0.075

0.050

0.311

N/A

16

0.300

0.407

0.092

0.009

0.101

0.050

0.406

MS-013

18

0.300

0.456

0.092

0.009

0.101

0.050

0.406

MS-013

20

0.300

0.505

0.092

0.009

0.101

0.050

0.406

MS-013

24

0.300

0.607

0.092

0.009

0.101

0.050

0.406

MS-013

28

0.300

0.706

0.092

0.009

0.101

0.050

0.406

MS-013

32

0.300

0.818

0.088

0.007

0.095

0.050

0.412

MO-119



For more information on our SOIC, please contact an Amkor Regional Sales Office near you or fill out the Request Form.

Packaging



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