The SOD323-FL power discrete package is part of the FLAT series of compact surface mount packages which allow communication equipment to be miniaturized. The Cu clip structure of interconnect features reduces electrical resistance and enhance thermal performance compared to wire-bonded products.

SOD323-FL Power DiscreteThis package may also be know as:

  • US-FLAT
  • TURP
  • MicroSMP

Application

  • The FLAT packages are suitable for the application of high-efficiency diodes, in small & medium size:
  • Schottky Barrier Diodes (SBDs)
  • Rectifier Diodes
  • Zener Diodes

Features

  • Cu connector structure to reduce inductance and resistance
  • Enhance thermal property
  • Turnkey with test and packing services
  • Green materials: Pb-free plating & halogen-free mold compound

New Developments

  • Larger/higher density leadframe strips
  • Environmentally friendly Pb-free solder paste

Process Highlights

  • Bare copper leadframe with no plating
  • Interconnect: Cu clips technology for better electrical and thermal performance
  • Plating: 100% matte Sn
  • Marking: Pen type laser
  • Standard Materials
  • Leadframe: Bare copper
  • Die attach: Solder paste
  • Interconnect: Cu clips
  • Mold compound: Halogen free

Reliability Qualification


Amkor devices are assembled with proven reliable semiconductor materials. All test includes pre-condition of: Ta = 85°C/Rh = 85%, 24 hrs with IR reflow, Ta = 260°C, 4X
  • Temperature & Humidity Storage, Ta = 85°C/Rh = 85%, 500 hrs
  • Pressure Cooker, Ta = 121°C/Rh = 100%/P = 2 atm, 500 hrs
  • Temperature Cycle, -65~150°C, 1000 cycles

Test Service


Amkor offers full turnkey business for all power discrete products. We have the capability to test various type of power devices including MOSFETs, bipolar transistors, IGBTs, diodes, regulator ICs/intelligent power devices, etc.

  • Amkor power discrete test capability:
    • Static test (DC)
    • Dynamic test (AC, Switching/Trr, Capacitance/Rg)
    • Destruction test (Inductive load/VSUS, I Latch, Surge, Isolation/VIL)
    • Thermal Resistance (ΔVDS, ΔmV, etc.)
  • Program generation/conversion
  • Failure analysis
  • Available test/handling technology
  • Integrated marking, vision inspection and tape & reel services

Shipping

  • Tape and reel packing
  • 4000 pcs per reel
  • Tape width 8 mm
  • Reel Φ = 180 mm
  • Barcode packing label
  • Drop ship

 SOD323FL Cross Section

SOD323FL Outline Drawing

For more information on our SOD323-FL Power Discrete package, please contact an Amkor Regional Sales Office near you or fill out the Request for Information Form.

Packaging