Amkor launched the popular Package Stackable Very Thin Fine Pitch BGA (PSvfBGA) platform in 2004. PSvfBGA supports single die, stacked die using wirebond or hybrid (FC plus wirebond) stacks and has been applied to Flip Chip (FC) applications to improve warpage control and package integrity through test and SMT handling.
As handheld microprocessors have transitioned to advanced CMOS nodes with higher speed cores with higher I/O, there has been a transition from wirebond to flip chip die designs. Flip chip enables the use of an exposed die bottom package that integrates the package stacking design features of PSvfBGA in a fcCSP assembly flow, which Amkor calls Package Stackable Flip Chip Chip Scale Package (PSfcCSP). PSfcCSP has a thin exposed flip chip die enabling fine pitch stacked interfaces at 0.5 mm pitch which is a challenge in a center molded PSvfBGA structure.
Continued development resulted in Amkor entering the second generation of PoP applications where new memory architectures, required in mobile multimedia applications, demand higher density stacked interfaces in combination with PoP mounted area and height reductions. The previous PSvfBGA and PSfcCSP structures limited the ability of the memory interface to scale in density and pitch, resulting in the need for a new bottom PoP structure.
Amkor developed new technologies to create the next generation PoP solution with interconnect vias through the mold cap, naming this technology Through Mold Via (TMV®).TMV technology provides a stable bottom package that enables use of thinner substrates with a larger die to package ratio. TMV enabled PoP can support single, stacked die or FC designs. TMV is an ideal solution for the emerging 0.4 mm pitch low power DDR2 memory interface requirements and enables the stacked interface to scale with solder ball pitch densities to 0.3 mm pitch or below.
The next few years promise to provide many new challenges and applications for PoP, as handheld multimedia applications continue to demand higher signal processing power and data storage capabilities. Amkor is committed to maintaining strong development and production capabilities to ensure we are at the forefront in meeting next generation PoP requirements.
Package-on-Packages are designed for products requiring efficient memory architectures including multiple buses and increased memory density and performance, while reducing mounted area. Portable electronic products such as mobile phones (baseband or applications processor plus combo memory), digital cameras (image processor plus memory), PDAs, portable media players (audio/graphics processor plus memory), gaming and other mobile applications can benefit from the combination of stacked package and small footprint offered by Amkor's industry leading PoP family.
PoP offers OEMs and EMS providers a flexible platform to cost effectively integrate logic plus memory devices in a 3D stacked architecture. Integration through PoP provides technical and business / logistics benefits:
Amkor assures a reliable performance by continuously monitoring key indices:
|Moisture Resistance Testing:||JEDEC Level 3 @ 260°C x 4 reflows|
|Additional Test Data:||30°C / 85% RH, 96 hrs @ 260°C x4|
|Temp Cycle:||-55 / +125°C, 1000 cycles|
|Temp / Humidity:||85°C / 85% RH, 1000 hours|
|High Tempature Storage:||150°C, 1000 hours|
|HAST:||130°C, 85% RH, 96 hours|
|Thermal Cycle:||-40 / +125°C, 1000 cycles|
|PSvfBGA:||10 x 10 mm to 15 x 15 mm|
|PSfcCSP:||12 x 12 mm to 13 x 13 mm|
|TMV® PoP:||12 x 12 mm to 14 x 14 mm|
|Die thickness:||75 µm to 125 µm|
|Bond pad pitch (min):||45 µm (In-line)|
|Wafer thinning:||200 mm & 300 mm wafers|
|-Dielectric:||Thin core FR5 or equivalent|
|Die attach adhesive:||Conductive or non conductive|
|Encapsulant:||Epoxy mold compound|
|Solder ball:||Pb free|
|Body Size (mm)||Package Interconnect Matrix||Package Interconnect Ball Count||Bottom Package Ball Count||Die Size (mm)||Pkg Interconnect ball center to package edge (mm)||Typical Wirecount for given pkg size|
|Body Size (mm)||Package Interconnect -
2 row Matrix
|Package Interconnect -
2 row Top Ball Count
0.4mm pitch (Full Matrix)
|Max. Die Size (mm)
|Max. Die Size (mm)
|A2 (4L laminate)||mm||0.220||0.300||0.210|
|A3 (Mold cap)||mm||0.230||0.280||0.250|
|B1 (Stacked gap)||mm||0.020||0.080||0.050|
|B2 (2L laminate)||mm||0.100||0.160||0.130|
|B3 (Mold cap)||mm||0.370||0.430||0.400|
|Overall Package Height||mm||1.140||1.340||1.240|
|A1 (mounted, 0.5 pitch)
|A2 (4L laminate)
|B1 (stacked, 0.65 pitch), single die
|B2 (stacked, 0.65 pitch), 2+0 die
|B3 (2L laminate)
|B4 (mold cap)
|Overall Package Height||mm||1.300||1.500||1.400|