The Amkor-developed family of power IC  PSOP (PowerSOP) packages significantly increases the thermal efficiency of power constrained standard SOIC packages. The PowerSOP (PSOP) improves Theta JA up to 50% over a standard SOIC thereby expanding the range of operating parameters. The large integrated exposed copper heatslug to which the IC chip is directly attached results in an increased ability to dissipate heat.

The PSOP leadframe and heat-slug are mechanically attached, leaving the leads electrically isolated. The PSOP 3 package is compliant to JEDEC outline MO-166.   The PSOP 2 packages are essentially compliant to JEDEC standards MS-012 or MS-013, except for the heat-slug exposure on the bottom of the package and the low stand-off height.  These design features allow maximum thermal management by directly soldering the slug to the PCB. 

Furthermore, there are two types of PSOPs (PSOP 2 and 3) available with various features and benefits to address different market application needs.

For more information on our PSOP or PSSOP package, please contact an Amkor Regional Sales Office near you or fill out the Request Form.