Amkor's Power Small Outline Package, PowerSOP® (PSOP3) is a leadframe based, plastic encapsulated package that is well suited for applications requiring optimum performance in IC packaging. This industry standard package utilizes a thick copper heat slug to accommodate the needs of higher power devices. A green BOM is standard, allowing devices to meet applicable Pb free and RoHS standards.

Services and Support:

Amkor has a broad base of resources available to help our customers bring quality new products to market quickly and at the lowest possible cost.

• Custom leadframe designs
• Full package characterization
• Thermal, mechanical stress, and electrical performance modeling
• Turnkey assembly, test and drop ship
• World class reliability testing and failure analysis

PSOP New Developments:

• Stealth dicing (narrow saw streets)
• Leadframe roughening for improved MSL capability

PSOP Features:

• Cu wire interconnect for low cost
• Standard JEDEC package outline
• Multi-die production capability
• Turnkey test services
• Green materials are standard - Pb free and RoHS compliant
• Theta JC of under 1° C/W can be achieved with optimal heatsinking
• Highly conductive copper heat-slug and leadframes
• PSOP3 has optional soft solder die attach for enhanced power capability

 

PSOP Thermal Performance:

Forced Convection, Single-Layer PCB; Theta JA (°C/W) by Velocity (LFPM)

Pkg	Body Size (mm)	S / NS	0	200	500
20 ld	5.1 x 5.1	S	50.8	35.7	27.8
20 ld	5.1 x 5.1	NS	52.4	37.6	28.8

 

Forced Convection, Multi-Layer PCB;Theta JA (°C/W) by Velocity (LFPM)

Pkg	Body Size (mm)	S / NS	0	200	500
20 ld	5.1 x 5.1	S	19.2	14.2	12.2
20 ld	5.1 x 5.1	NS	25.7	20.4	17.8

JEDEC Standard Test Boards: S = Slug soldered to test board; NS = Slug NOT soldered to test board

PSOP Electrical Performance:

Simulated Results @ 100MHz

Pkg	Body Size (mm)	Pad Size (mm)	Lead	Inductance (nH)	Capacitance (pF)	Resistance (mΩ)
20 ld	11 x 15.9	7.5 x 7.9	Longest	3.130	1.990	30.6
20 ld	11 x 15.9	7.5 x 7.9	Shortest	1.540	0.604	9.42

 

PSOP Reliability Qualification:

Amkor package qualification uses three independent production lots and a minimum of 77 units per test group. All testing includes JSTD-020 moisture preconditioning.

MSL:	JEDEC Level 3, 30°C / 60% RH, 192 hrs
uHAST:	130°C / 85% RH, No Bias, 96 hours
Temp cycle:	-65 / 150°C, 500 cycles
HTS	150°C, 1000 hours

 

Process Highlights:

• Cu wire bonding standard
• Wafer backgrinding services available
• Multiple die and die stacking capability
• NiPdAu (PPF) or Matte Sn lead finish options
• Laser Mark on package body

Test Services:

Contact Amkor Test Services for more details.

• Program generation / conversion
• Wafer probe
• Burn-in
• Tape and reel services
• -55°C to +165°C test available

Shipping:

• Clear anti-static tube (20 inch)
• Tape and reel
• Bar code
• Dry pack
• Drop ship

 

PSOP Cross Section:

 

For more information on our PSOP or PSSOP package, please contact an Amkor Regional Sales Office near you or fill out the Request Form.