Amkor’s PBGAs incorporate the most advanced assembly processes and designs for today’s and tomorrow’s cost/performance applications. This advanced IC package technology allows application and design engineers to optimize innovations while maximizing the performance characteristics of semiconductors.
Amkor’s PBGAs are designed for low inductance, improved thermal operation and enhanced SMT ability. Custom performance enhancements, like ground and power planes, are available for significant improvements in electrical response demanded by advancing electronics.
Additionally, these PBGAs utilize industry proven, semiconductor grade materials for reliable, long-term operations while providing the user flexible design parameters.
Amkor’s thermally enhanced PBGA, TEPBGA-2, is fully compatible with the PGM process.
Semiconductor technologies find enhanced performance by using the integrated design features of Amkor’s PBGAs. Microprocessors / controllers, ASICs, Gate Arrays, memory, DSPs, PLDs, graphics and PC chip sets find Amkor’s PBGA family to be an ideal package.
Applications requiring improved portability, form-factor/size and high-performance such as cellular, wireless telecommunications, PCMCIA cards, global positioning systems (GPS), laptop PC’s, netbooks, video cameras, disc drives, PLDs, graphics and other similar products benefit from Amkor’s PBGA attributes.
Innovative designs and expanding package offerings provide a platform from prototype-to-production.
* - Max Power shown are estimates based on: 35x35 Body - 10.2X10.2 mm Die, 64 thermal balls/vias, ΔT = 50C, No Air Flow, JEDEC Multilayer PCB
|Moisture sensitivity characterization:||JEDEC Level 3, 30°C / 60% RH, 192 hours|
|High temp storage:||150°C, 1000 hours|
|Autoclave or unbiased hast:||130°C / 85% RH / 96 hours|
| Temp cycle:||-55 /+125°C, 1000 cycles|
|Die Thickness (max):||13 mils|
|Bond Pad Pitch (min):|| 2.4 mils|
|Au Wire Dia: || 1.2 - 0.5 mils|
|Cu Wire Dia: || 1.2 - 0.7 mils|
|Pack / Ship Options:||JEDEC trays, Dry Pack|
|Die attach:||Ablestik 2300|
|Mold compound:||Nitto GE100L|
|Solder balls:|| Leaded or Lead-Free Options|