PBGA
PGM-PBGA (Pin-Gate Molded PBGA)
MCM-PBGA (Multi-Chip Module PBGA)
TEPBGA (Thermally Enhanced PBGA)

Amkor’s PBGAs incorporate the most advanced assembly processes and designs for today’s and tomorrow’s cost/performance applications. This advanced IC package technology allows application and design engineers to optimize innovations while maximizing the performance characteristics of semiconductors.

Amkor’s PBGAs are designed for low inductance, improved thermal operation and enhanced SMT ability. Custom performance enhancements, like ground and power planes, are available for significant improvements in electrical response demanded by advancing electronics.

Additionally, these PBGAs utilize industry proven, semiconductor grade materials for reliable, long-term operations while providing the user flexible design parameters.

Amkor’s thermally enhanced PBGA, TEPBGA-2, is fully compatible with the PGM process.  

PBGA Applications:

Semiconductor technologies find enhanced performance by using the integrated design features of Amkor’s PBGAs. Microprocessors / controllers, ASICs, Gate Arrays, memory, DSPs, PLDs, graphics and PC chip sets find Amkor’s PBGA family to be an ideal package.

Applications requiring improved portability, form-factor/size and high-performance such as cellular, wireless telecommunications, PCMCIA cards, global positioning systems (GPS), laptop PC’s, netbooks, video cameras, disc drives, PLDs, graphics and other similar products benefit from Amkor’s PBGA attributes.

PBGA Features:

Innovative designs and expanding package offerings provide a platform from prototype-to-production.

  • Custom ball counts up to 1521
  • 1.00, 1.27 & 1.50 mm ball pitch available (Other ball pitches available upon request)
  • 17 mm to 40 mm body sizes
  • Thin Au wire (0.5mil) or Cu wire compatible
  • Chip-on-Chip (CoC)
  • 63 Sn/37 Pb Eutectic or Pb-free solder balls
  • Large mold cap for quality enhancement
  • Low Profile and lightweight
  • Thermal and electrical enhancement capable
  • Highly flexible internal routing of signal, power and ground for device performance and system compatibility
  • HDI designs possible
  • Suitable substrate for multi-die (MCM) and integrated SMT structures
  • Mature strip based manufacturing process with high yields
  • Full in-house design capability
  • Quickest design-to-prototype delivery
  • Perimeter, stagger and full ball arrays
  • Special packaging for memory available
  • Multi-layer, ground / power
  • JEDEC MS-034 standard outlines
  • Excellent reliability

 

PBGA Thermal Performance vs. Cost

PBGA Thermal Resistance
* - Max Power shown are estimates based on: 35x35 Body - 10.2X10.2 mm Die, 64 thermal balls/vias, ΔT = 50C, No Air Flow, JEDEC Multilayer PCB

PBGA Reliability:

Amkor assures you reliable performance by continuously monitoring key indices:
Moisture sensitivity characterization:   JEDEC Level 3, 30°C / 60% RH, 192 hours
High temp storage:   150°C, 1000 hours
Autoclave or unbiased hast:   130°C / 85% RH / 96 hours
 Temp cycle:
   -55 /+125°C, 1000 cycles
 

 

PBGA Cross Section

 

PBGA Process Highlights:

Die Thickness (max):  13 mils
Bond Pad Pitch (min):  2.4 mils
Au Wire Dia:
 1.2 - 0.5 mils
Cu Wire Dia:
 1.2 - 0.7 mils
Marking:  Laser
Ball Inspection:  Optical
Pack / Ship Options:  JEDEC trays, Dry Pack
Wafer Backgrinding:  Available

 

Standard Materials:

Package Substrate:  CCL-HL832
Die attach:  Ablestik 2300
Au wire:  HTS
Mold compound:  Nitto GE100L
Solder balls:  Leaded or Lead-Free Options


Test Services:

  • Program generation / conversion
  • Product engineering
  • Wafer sort
  • 256 Pin x 20 MHz Test System available
  • -55°C to + 125°C Test available
  • Tape and Reel Services
  • Burn-in


Shipping:

  • Low Profile Tray (JEDEC Outline CO-029)


For more information on the PBGA (Plastic BGA) package, please contact an Amkor Regional Sales Office near you or fill out the Request Form

Packaging



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