Amkor's multi-chip package (MCP) and stacked-die leadframe designs enable package level integration in a low cost, leadframe-based form factor. Leveraging existing leadframe-based manufacturing capabilities and infrastructure allows for stable, high volume production, and adds flexibility to system designs to provide smaller, denser footprints.

This results in more efficient use of motherboard real estate, and a lighter, smaller overall system which supports end system level cost reductions.

For more information on the multi-chip package (MCP) and stacked-die leadframe packages, please contact an Amkor Regional Sales Office near you or fill out the Request Form.