MQFPAmkor’s MQFP (Metric QFP) package affords the designer or systems engineer the flexibility of growing or shrinking IC package size based upon application need. Amkor employs the most up-to-date, advanced equipment, material and processes to assure successful, reliable performance of your IC chips. Having a complete line of MQFPs (QFP) available and at your disposal means security, convenience and success.

Thermal Enhancement:

Some MQFP (QFP) designs and applications require an added margin of thermal performance (power). Amkor’s easy and cost-effective solution is a heat spreader. This optional embedded thermal aid improves Theta JA as much as 15% (without external heat sinks or fans) by supplementing the heat dissipation path from the IC chip to the PCB.
 
For more information on the MQFP (Metric QFP) package, please contact an Amkor Regional Sales Office near you or fill out the Request Form

Packaging



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