Systems and applications that operate at moderate levels of power need more power performance than MQFPs (QFP) can deliver. Amkor has developed a low cost package system, available in QFP format, to better suit these applications. This solution provides improved power dissipation, achieved by using an exposed copper / aluminum heat slug. This large, highly efficient copper / aluminum heat slug readily extracts heat generated from the chip though the leadframe paddle to which the IC is attached. Thermal resistance improvements of approximately 80% (over a standard QFP) can be realized with this IC package without the use of any external cooling aids!

Finally, the MQFP PowerQuad® 4 heat slug has a built-in mechanical package-encapsulant "lock" feature to ensure package integrity and eliminate moisture penetration. The end result is a moderate power, IC package with the properties to enable more reliable solutions to the electronic marketplace.

For more information on our MQFP PowerQuad® 4, please contact an Amkor Regional Sales Office near you or fill out the Request Form.