Amkor's MicroLeadFrame® (MLF | MLP | LFCSP | VQFN | QFN - Quad Flat No-Lead package) is a near CSP plastic encapsulated package with a copper leadframe substrate. This package uses perimeter lands on the bottom of the package to provide electrical contact to the PWB. The package also offers Amkor's ExposedPad technology as a thermal enhancement by having the die attach paddle exposed on the bottom of the package surface to provide an efficient heat path when soldered directly to the PWB. This enhancement also enables stable ground by use of down bonds or by electrical connection through a conductive die attach material.
Amkor Technology offers its QFN package design kit for Agilent Technologies’ Advanced Design System (ADS) electronic design automation software. Based on Amkor’s popular MicroLeadFrame® packages, the package design kit gives ADS users access to the full fidelity of Amkor packages at the click of a button. This allows them to reduce design spins and cut time-to-market by rapidly characterizing circuits in the presence of actual Amkor packages, before manufacturing and performing what-ifs. Download the ADS Kit here.
MicroLeadFrame Features:
- Small size (reduce package footprint by 50% or more and improved RF performance) & weight
- Standard leadframe process flow and equipment
- Excellent thermal and electrical performance
- 0.4 mm to 2.03 mm maximum height
- 4 to 180 I/O
- 1 - 13 mm Body size
- Thin profile and superior die to body size ratio
- Pb Free / Green
- Flexible Designs and High Yields
- SAW and Punch versions available
MLF Offerings:
- Chip-on-Lead (COL)
- Single Row Up to 108 I/O
- Dual Row Up to 180 I/O
- Multi Chip Package
- Non-Exposed Pad
- PPF (NiPd) Punch & SAW MicroLeadFrame (MLF)
- Small MLF (Less than 2 x 2 body size)
- Flip Chip MLF (fcMLF)
- Thin MicroLeadFrame
- Top Exposed Pad (TEP)
- Inframe Cavity MicroLeadFrame
Dual Row MLF Package:
An MicroLeadFrame package with 2 rows of lands — a cost effective, high performance solution for devices requiring up to 180 I/O. Typical applications include hard disk drives, USB controllers, and Wireless LAN.
MicroLeadFrame Applications:
The small size and weight along with excellent thermal and electrical performance make the MicroLeadFrame® package an ideal choice forhandheld portable applications such as cell phones and PDAs or any other application where size, weight and package performance are required issues.
MicroLeaadFrame Thermal Performance
Modeled data @ 0 air flow / JEDEC Multi-layer PCB
| Pkg | Body Size (mm) | Board Vias # | Exposed Pad (mm) | Die (mm) | Theta JA (°C/W) |
|---|---|---|---|---|---|
| 12 ld | 3 x 3 | 1 | 1.25 | 1.25 | 61.1 |
| 28 ld | 5 x 5 | 9 | 2.7 | 2.54 | 34.8 |
| 44 ld | 7 x 7 | 16 | 4.8 | 3.81 | 24.4 |
| 52 ld | 8 x 8 | 25 | 6.1 | 5.08 | 20.9 |
| 64 ld | 10 x 10 | 36 | 7.1 | 2.79 | 29.4 |
| 124 ld | 10 x 10 | 36 | 7.1 | 2.79 | 30 |
MicroLeadFrame Electrical Performance
Simulated results @ 2GHz. Values dependant on specific die and wire configurations
| Pkg | Body Size (mm) | I/O | (nH) | (pF) | (mOhm) |
|---|---|---|---|---|---|
| 12 ld | 3 x 3 | Longest | 0.564 | 0.203 | 141.8 |
| 12 ld | 3 x 3 | Shortest | 0.531 | 0.220 | 138.9 |
| 44 ld | 7 x 7 | Longest | 1.766 | 0.326 | 315.1 |
| 44 ld | 7 x 7 | Shortest | 1.194 | 0.289 | 234.5 |
| 64 ld | 10 x 10 | Longest | 2.179 | 0.518 | 337.5 |
| 64 ld | 10 x 10 | Shortest | 1.475 | 0.409 | 250.8 |
MicroLeadFrame Reliability:
Amkor’s MicroLeadFrame® Packages are reliability assured through optimized design, material and process enabling high performance operation of your IC amp.
| Moisture Sensitivity Characterization: | JEDEC Level 1 (depending on body size) 85°C / 85%, 168 hours |
| Temp / Humidity: | 85°C / 85% RH, 1000 hours |
| HAST: | 130°C, 85% RH, 96 hours |
| High temp storage: | 150°C, 1000 hours |
| Temp cycle: | -65 / +150°C, 1000 cycles |
Process Highlights:
| Die Thickness: | .20 ± .05 mm nominal, thinner for special applications |
| Plating: | Matte Sn, NiPdAuAg |
| Marking: | Laser |
Standard Materials:
| Leadframe: | Copper Alloy, Dual Gauge |
| Die attach: | Conductive Epoxy |
| Wire: | 0.8 mil Au, 1% Pd doped, 0.8 mil Cu |
| Mold compound: | Pb free / Green Capable |
Test Services:
- Program generation / conversion
- Product engineering support
- Available test / handling technology
- Tape and Reel Services
- Burn-in capabilities
Shipping:
- This product is shipped in clear anti-static tubes, bakable trays or metal canisters.
Configuration Options:
| Body Size (mm) | QFN / DFN / SON Leadcounts 0.8, 0.65, 0.5, 0.4, 0.35, 0.3 mm Pitch | Dual Row Leadcounts 0.5 mm Pitch |
|---|---|---|
| < 2 x 2 (saw only) | - | - |
| 2 x 3 | - | - |
| 3 x 3 | 4 / 8 / 10 / 12 / 16 / 20 / 24 | - |
| 4 x 4 | 12 / 16 / 20 / 24 / 28 / 32 / 40 | - |
| 5 x 5 | 16 / 20 / 28 / 32 / 36 / 40 / 44 / 52 | 44 / 52 |
| 6 x 5 | 18 / 24 / 36 / 42 | - |
| 6 x 6 | 20 / 24 / 28 / 36 / 40 / 48 / 56 / 64 | 60 / 68 |
| 7 x 7 | 28 / 32 / 36 / 44 / 48 / 56 / 68 / 80 | 76 / 84 |
| 8 x 8 | 32 / 36 / 40 / 52 / 56 / 68 / 76 / 88 | 92 / 100 |
| 9 x 9 | 36 / 44 / 48 / 60 / 64 / 76 / 88 / 104 | 108 / 116 |
| 10 x 10 | 44 / 52 / 56 / 68 / 72 / 88 / 100 / 116 | 124 / 132 |
| 11 x 11 | - | 140 / 148 |
| 12 x 12 | 48 / 60 / 84 / 88 / 100 / 108 / 124 / 144 | 156 / 164 |
| 13 x 13 | - | 164 / 180 |
MicroLeadFrame Cross Sections:
Individual Unit Design "Punch"
MAP Design "Saw"
Package Height Comparison
For more information on the MicroLeadFrame (MLF | MLP | LFCSP | VQFN | QFN) package, please contact an Amkor Regional Sales Office near you or fill out the Request Form.