Amkor's MicroLeadFrame® (MLF | MLP | LFCSP | VQFN | QFN - Quad Flat No-Lead package) is a near CSP plastic encapsulated package with a copper leadframe substrate. This package uses perimeter lands on the bottom of the package to provide electrical contact to the PWB. The package also offers Amkor's ExposedPad technology as a thermal enhancement by having the die attach paddle exposed on the bottom of the package surface to provide an efficient heat path when soldered directly to the PWB. This enhancement also enables stable ground by use of down bonds or by electrical connection through a conductive die attach material.

Amkor Technology offers its QFN package design kit for Agilent Technologies’ Advanced Design System (ADS) electronic design automation software. Based on Amkor’s popular MicroLeadFrame® packages, the package design kit gives ADS users access to the full fidelity of Amkor packages at the click of a button. This allows them to reduce design spins and cut time-to-market by rapidly characterizing circuits in the presence of actual Amkor packages, before manufacturing and performing what-ifs.  Download the ADS Kit here.

MicroLeadframeMicroLeadFrame Features:

  • Small size (reduce package footprint by 50% or more and improved RF performance) & weight
  • Standard leadframe process flow and equipment
  • Excellent thermal and electrical performance
  • 0.4 mm to 2.03 mm maximum height
  • 4 to 180 I/O
  • 1 - 13 mm Body size
  • Thin profile and superior die to body size ratio
  • Pb Free / Green
  • Flexible Designs and High Yields
  • SAW and Punch versions available

MLF Board SpaceMLF Offerings:

  • Chip-on-Lead (COL)
  • Single Row Up to 108 I/O
  • Dual Row Up to 180 I/O
  • Multi Chip Package
  • Non-Exposed Pad
  • PPF (NiPd) Punch & SAW MicroLeadFrame (MLF)
  • Small MLF (Less than 2 x 2 body size)
  • Flip Chip MLF (fcMLF)
  • Thin MicroLeadFrame
  • Top Exposed Pad (TEP)
  • Inframe Cavity MicroLeadFrame


Dual Row MLF Package:

Punch MLF

An MicroLeadFrame package with 2 rows of lands — a cost effective, high performance solution for devices requiring up to 180 I/O. Typical applications include hard disk drives, USB controllers, and Wireless LAN.


MicroLeadFrame Applications:

The small size and weight along with excellent thermal and electrical performance make the MicroLeadFrame® package an ideal choice forhandheld portable applications such as cell phones and PDAs or any other application where size, weight and package performance are required issues.

MicroLeadFrame Thermal Performance

Modeled data @ 0 air flow / JEDEC Multi-layer PCB

PkgBody Size (mm)Board Vias #Exposed Pad (mm)Die (mm)Theta JA (°C/W)
12 ld3 x 311.251.2561.1
28 ld5 x 592.72.5434.8
44 ld7 x 7164.83.8124.4
52 ld8 x 8256.15.0820.9
64 ld10 x 10 367.12.7929.4
124 ld10 x 10 367.12.7930

 

MicroLeadFrame Electrical Performance

Simulated results @ 2GHz. Values dependant on specific die and wire configurations

PkgBody Size (mm)I/O(nH)(pF)(mOhm)
12 ld3 x 3 Longest0.5640.203141.8
12 ld3 x 3 Shortest0.5310.220138.9
44 ld7 x 7Longest1.7660.326315.1
44 ld7 x 7Shortest1.1940.289234.5
64 ld10 x 10 Longest2.1790.518337.5
64 ld10 x 10Shortest1.4750.409250.8


MicroLeadFrame Reliability:

Amkor’s MicroLeadFrame® Packages are reliability assured through optimized design, material and process enabling high performance operation of your IC amp.

Moisture Sensitivity Characterization:   JEDEC Level 1 (depending on body size) 85°C / 85%, 168 hours
Temp / Humidity:   85°C / 85% RH, 1000 hours
HAST:   130°C, 85% RH, 96 hours
High temp storage:   150°C, 1000 hours
Temp cycle:   -65 / +150°C, 1000 cycles

 

Process Highlights:

Die Thickness:  .20 ± .05 mm nominal, thinner for special applications
Plating:  Matte Sn, NiPdAuAg
Marking:  Laser


Standard Materials:

Leadframe:  Copper Alloy, Dual Gauge
Die attach:  Conductive Epoxy
Wire:  0.8 mil Au, 1% Pd doped, 0.8 mil Cu
Mold compound:  Pb free / Green Capable


MLF MicroleadframeTest Services:

  • Program generation / conversion
  • Product engineering support
  • Available test / handling technology
  • Tape and Reel Services
  • Burn-in capabilities


Shipping:

  • This product is shipped in clear anti-static tubes, bakable trays or metal canisters.


Configuration Options:

Body Size (mm) QFN / DFN / SON Leadcounts
0.8, 0.65, 0.5, 0.4, 0.35, 0.3 mm Pitch
Dual Row Leadcounts
0.5 mm Pitch
< 2 x 2 (saw only)--
2 x 3--
3 x 34 / 8 / 10 / 12 / 16 / 20 / 24
-
4 x 412 / 16 / 20 / 24 / 28 / 32 / 40
-
5 x 5 16 / 20 / 28 / 32 / 36 / 40 / 44 / 52
44 / 52
6 x 5 18 / 24 / 36 / 42
-
6 x 6 20 / 24 / 28 / 36 / 40 / 48 / 56 / 64
60 / 68
7 x 7 28 / 32 / 36 / 44 / 48 / 56 / 68 / 80
76 / 84
8 x 8 32 / 36 / 40 / 52 / 56 / 68 / 76 / 88
92 / 100
9 x 9 36 / 44 / 48 / 60 / 64 / 76 / 88 / 104
108 / 116
10 x 10 44 / 52 / 56 / 68 / 72 / 88 / 100 / 116
124 / 132
11 x 11 -140 / 148
12 x 12 48 / 60 / 84 / 88 / 100 / 108 / 124 / 144
156 / 164
13 x 13
 -164 / 180

 

MicroLeadFrame Cross Sections:

Individual Unit Design "Punch"

 

 MLF Punch cross section

 

 

MAP Design "Saw"

 MLF Saw Cross Section

 

Package Height Comparison

MLF height comparison

For more information on the MicroLeadFrame (MLF | MLP | LFCSP | VQFN | QFN) package, please contact an Amkor Regional Sales Office near you or fill out the Request Form.

Packaging



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