Amkor's MicroLeadFrame® (MLF | MLP | LFCSP | VQFN | QFN - Quad Flat No-Lead package) is a near CSP plastic encapsulated package with a copper leadframe substrate. This package uses perimeter lands on the bottom of the package to provide electrical contact to the PWB. The package also offers Amkor's ExposedPad technology as a thermal enhancement by having the die attach paddle exposed on the bottom of the package surface to provide an efficient heat path when soldered directly to the PWB. This enhancement also enables stable ground by use of down bonds or by electrical connection through a conductive die attach material.
Amkor Technology offers its QFN package design kit for Agilent Technologies’ Advanced Design System (ADS) electronic design automation software. Based on Amkor’s popular MicroLeadFrame® packages, the package design kit gives ADS users access to the full fidelity of Amkor packages at the click of a button. This allows them to reduce design spins and cut time-to-market by rapidly characterizing circuits in the presence of actual Amkor packages, before manufacturing and performing what-ifs. Download the ADS Kit here.
The small size and weight along with excellent thermal and electrical performance make the MicroLeadFrame® package an ideal choice forhandheld portable applications such as cell phones and PDAs or any other application where size, weight and package performance are required issues.
An MicroLeadFrame package with 2 rows of lands — a cost effective, high performance solution for devices requiring up to 180 I/O. Typical applications include hard disk drives, USB controllers, and Wireless LAN.
Customer demand for Fine lead pitch (0.50 mm, 0.65 mm) is needed in the automotive Industry. Higher solder fillet height on the side of lead area; similar or better BLR performance than standard design; no need of X-ray monitoring after SMD. This process is released to HVM (High Volume Manufacturing).
Better release-ability which enables complicated mold structures like cavity open packages (Seal film); Protection on brittle surface of die and glass lids from mechanical impact by cavity insert on mold chase (seal film); resin/mold flash control (adhesive film).
To qualify FET (Field Effect Transistor) devices in QFN package using solder paste and copper clip; layout and packaging use copper connections for all power paths rather than wire bonds, reducing losses due to high resistance wire bonds as well as high inductance which cause ringing and high AC losses.
An MLF® package with resin filled traces for small form factor driven structures. This offers a low cost, high thermal performance device in a smaller foot print. It has internal routing traces with limited line width/space capability and this package adapts easily to flipchip configurations. rtMLF provides higher pin count and more flexible internal trace routing with resin filled LF. It enable small form factor, high electrical/thermal performance with low cost.
Modeled data @ 0 air flow / JEDEC Multi-layer PCB
|Pkg||Body Size (mm)||Board Vias #||Exposed Pad (mm)||Die (mm)||Theta JA (°C/W)|
|12 ld||3 x 3||1||1.25||1.25||61.1|
|28 ld||5 x 5||9||2.7||2.54||34.8|
|44 ld||7 x 7||16||4.8||3.81||24.4|
|52 ld||8 x 8||25||6.1||5.08||20.9|
|64 ld||10 x 10||36||7.1||2.79||29.4|
|124 ld||10 x 10||36||7.1||2.79||30|
Simulated results @ 2GHz. Values dependant on specific die and wire configurations
|Pkg||Body Size (mm)||I/O||(nH)||(pF)||(mOhm)|
|12 ld||3 x 3||Longest||0.564||0.203||141.8|
|12 ld||3 x 3||Shortest||0.531||0.220||138.9|
|44 ld||7 x 7||Longest||1.766||0.326||315.1|
|44 ld||7 x 7||Shortest||1.194||0.289||234.5|
|64 ld||10 x 10||Longest||2.179||0.518||337.5|
|64 ld||10 x 10||Shortest||1.475||0.409||250.8|
Amkor’s MicroLeadFrame® Packages are reliability assured through optimized design, material and process enabling high performance operation of your IC amp.
|Moisture Sensitivity Characterization:||JEDEC Level 1 (depending on body size) 85°C / 85%, 168 hours|
|Temp / Humidity:||85°C / 85% RH, 1000 hours|
|HAST:||130°C, 85% RH, 96 hours|
|High temp storage:||150°C, 1000 hours|
|Temp cycle:||-65 / +150°C, 1000 cycles|
|Die Thickness:||.20 ± .05 mm nominal, thinner for special applications|
|Plating:|| Matte Sn, NiPdAuAg|
|Leadframe:||Copper Alloy, Dual Gauge|
|Die attach:||Conductive Epoxy, Non-conductive Epoxy or DAF|
|Wire:|| 0.8 mil Au, 1% Pd doped, 0.8 mil Cu|
|Mold compound:||Pb free / Green Capable|
|SAW||Punch||Body Size (mm)||QFN / DFN / SON Leadcounts
0.8, 0.65, 0.5, 0.4, 0.35, 0.3 mm Pitch
|Dual Row Leadcounts
0.5 mm Pitch
|YES||NO||1 x 1||4/6||-|
|YES||NO||2 x 2||6/8/10/12||-|
|YES||YES||3 x 3||4/8/10/12/16/20/24
|YES||YES||4 x 4||12/16/20/24/28/32/40
|YES||YES||5 x 5||16/20/28/32/36/40/44/52
|YES||YES||6 x 5||18/24/36/42
|YES||YES||6 x 6||20/24/28/36/40/48/56/64
|YES||YES||7 x 7||28/32/36/44/48/56/68/80
|YES||YES||8 x 8||32/36/40/52/56/68/76/88
|YES||YES||9 x 9||36/44/48/60/64/76/88/104
|YES||YES||10 x 10||44/52/56/68/72/88/100/116
|NO||YES||11 x 11||-||140/148
|NO||YES||12 x 12||48/60/84/88/100/108/124/144
|NO||YES||13 x 13