Amkor's MicroLeadFrame® (MLF | MLP | LFCSP | QFN - Quad Flat No-Lead package) is a near CSP plastic encapsulated package with a copper leadframe substrate. This package uses perimeter lands on the bottom of the package to provide electrical contact to the PWB. The package also offers Amkor's ExposedPad technology as a thermal enhancement by having the die attach paddle exposed on the bottom of the package surface to provide an efficient heat path when soldered directly to the PWB. This enhancement also enables stable ground by use of down bonds or by electrical connection through a conductive die attach material.

Amkor Technology offers its QFN package design kit for Agilent Technologies’ Advanced Design System (ADS) electronic design automation software. Based on Amkor’s popular MicroLeadFrame® packages, the package design kit gives ADS users access to the full fidelity of Amkor packages at the click of a button. This allows them to reduce design spins and cut time-to-market by rapidly characterizing circuits in the presence of actual Amkor packages, before manufacturing and performing what-ifs.  Download the ADS Kit here.

For more information on the MicroLeadFrame (MLF | MLP | QFN) package, please contact an Amkor Regional Sales Office near you or fill out the Request Form.