The MCM-PBGA (Multi-Chip Module Plastic Ball Grid Array) by Amkor incorporates the latest technology in high-density plastic IC packaging. The high-speed performance and thermal advantages of the PBGA package provide the platform to mix semiconductor technologies such as analog, digital, bipolar, CMOS, ASIC, memory, etc., in a single IC package.

The affordability of our MCM-PBGAs enable systems designers to realize their vision of new, advanced or improved applications. Our designs are optimized to use standard PBGA package outline tooling to save you costs and utilize a proven BGA infrastructure. Additionally, we work with you to produce the most efficient substrate circuit design that will enhance the operation and performance of your IC chips. Our advanced in-house design center and electrical test support services complete the turn-key solution.

For more information on the MCM-PBGA package, please contact an Amkor Regional Sales Office near you or fill out the Request Form.