Amkor offers a broad line of LQFP (QFP) IC packages designed to provide the same great benefits as MQFP packaging with a 1.4 mm body thickness. This allows IC packaging engineers, component specifiers and systems designers to solve issues such as increasing board density, die shrink programs, thin end-product profile and portability.

LQFPLQFP Package Features:

Amkor’s LQFP packaging portfolio provides many features.

  • 7 x 7 mm to 28 x 28 mm body size
  • 32 to 256 lead counts
  • Copper leadframes
  • Custom leadframe design available
  • Low stress BOM for stress sensitive products
  • Broad selection of die pad sizes
  • 1.4 mm body thickness
  • PB-Free and RoHS compliant materials


LQFP Thermal Resistance:

Single-Layer PCB, JEDEC Standard Test Boards, Tested @1 W
Theta JA (°C/W) by Velocity (LFPM)

Pkg Body Size (mm) Pad Size 0 200 500
32 ld 7 x 7
5 x 5
67.8
55.9
50.1
100 ld 14 x 14
8 x 8
41.5 33.4
29.5
100 ld 14 x 20
9.5 x 9.5 39.7
31.8
28.3
144 ld 20 x 20 8.5 x 8.5 38.0
31.2
28.1
176 ld
24 x 24 8 x 8
38.3
31.9
29.0

 

Multi-Layer PCB, JEDEC Standard Test Boards, Tested @1 W
Theta JA (°C/W) by Velocity (LFPM)

Pkg Body Size (mm) Pad Size 0 200 500
32 ld 7 x 7
5 x 5
479 42.1 39.4
100 ld 14 x 14
8 x 8
31.7 26.8 24.7
100 ld 14 x 20
9.5 x 9.5 30.0 25.1 23.0
144 ld 20 x 20 8.5 x 8.5 31.7 26.9 24.9
176 ld
24 x 24 8 x 8
31.9 27.3 25.4
 208 ld
 28 x 28
 16 x 16
 18.1 15.3 14.4

 


LQFP Electrical Performance:

Simulated Results @100 MHz

PkgBody Size (mm)Pad Size (mm)LeadInductance (nH)Capacitance (pF)Resistance (mOmega)
32 ld7 x 7
5 x 5
Longest0.9040.211
9.2
32 ld7 x 75 x 5Shortest0.7990.2027.8
48 ld
7 x 75 x 5Longest1.1100.22513.8
48 ld
7 x 75 x 5Shortest0.9620.20012.0
 100 ld
 14 x 14
 8 x 8
 Longest 2.300 0.419 26.3
 100 ld
 14 x 14 8 x 8 Shortest 1.520 0.322 17.8
 144 ld
 20 x 20
 8.5 x 8.5
 Longest 6.430 1.100 62.9
 144 ld
 20 x 20 8.5 x 8.5 Shortest 4.230 1.070 52.6
 176 ld
 24 x 24
 8 x 8
 Longest 9.510 1.27089.0
 176 ld 24 x 24 8 x 8 Shortest 5.200 1.340 64.0
 208 ld
 28 x 28
 11 x 11  Longest 9.670 1.38086.2
 208 ld
 28 x 28 11 x 11  Shortest 6.190 1.210 64.8

 

LQFP Reliability Qualification:

IC chips are assembled in optimized package designs with proven reliable semiconductor materials.

Moisture sensitivity characterization:   JEDEC Level 3,  30°C / 60% RH, 192 hrs
PCT:   121°C, 100% RH, 2 atm, 504 hours
High temp storage:   150°C, 1000 hrs.
Temp/Humidity:   85°C / 85% RH, 1000 hours
Temp cycle:   -55 / +125°C, 1000 cycles

 

LQFP Process Highlights:

Die thickness:   14.5 ± .5 mil
Strip Solder plating:   Matte Sn and Pre-Plated package options, (ie: Ni / Pd frames)
Marking:   Laser
Lead inspection:   Laser / Optical
Pack/ship options:   Bar code, dry pack
Wafer backgrinding:   Available


Test Services:

  • Program generation / conversion
  • Product engineering support
  • Wafer sort
  • Burn-in
  • -55°C to + 165°C test available
  • 256 pin x 20 MHz test system available


Shipping:

  • JEDEC outline CO-124 low profile tray

 

LQFP Cross Section:

LQFP Cross Section

 

For more information on the LQFP (QFP) package, please contact an Amkor Regional Sales Office near you or fill out the Request Form.

Packaging



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