Amkor offers a broad line of LQFP (QFP) IC packages designed to provide the same great benefits as MQFP packaging with a 1.4 mm body thickness. This allows IC packaging engineers, component specifiers and systems designers to solve issues such as increasing board density, die shrink programs, thin end-product profile and portability.
LQFP Package Features:
Amkor’s LQFP packaging portfolio provides many features.
- 7 x 7 mm to 28 x 28 mm body size
- 32 to 256 lead counts
- Copper leadframes
- Custom leadframe design available
- Low stress BOM for stress sensitive products
- Broad selection of die pad sizes
- 1.4 mm body thickness
- PB-Free and RoHS compliant materials
LQFP Thermal Resistance:
Single-Layer PCB, JEDEC Standard Test Boards, Tested @1 W
Theta JA (°C/W) by Velocity (LFPM)
| Pkg | Body Size (mm) | Pad Size | 0 | 200 | 500 |
|---|---|---|---|---|---|
| 32 ld | 7 x 7 |
5 x 5 |
67.8 |
55.9 |
50.1 |
| 100 ld | 14 x 14 |
8 x 8 |
41.5 | 33.4 |
29.5 |
| 100 ld | 14 x 20 |
9.5 x 9.5 | 39.7 |
31.8 |
28.3 |
| 144 ld | 20 x 20 | 8.5 x 8.5 | 38.0 |
31.2 |
28.1 |
| 176 ld |
24 x 24 | 8 x 8 |
38.3 |
31.9 |
29.0 |
Multi-Layer PCB, JEDEC Standard Test Boards, Tested @1 W
Theta JA (°C/W) by Velocity (LFPM)
| Pkg | Body Size (mm) | Pad Size | 0 | 200 | 500 |
|---|---|---|---|---|---|
| 32 ld | 7 x 7 |
5 x 5 |
479 | 42.1 | 39.4 |
| 100 ld | 14 x 14 |
8 x 8 |
31.7 | 26.8 | 24.7 |
| 100 ld | 14 x 20 |
9.5 x 9.5 | 30.0 | 25.1 | 23.0 |
| 144 ld | 20 x 20 | 8.5 x 8.5 | 31.7 | 26.9 | 24.9 |
| 176 ld |
24 x 24 | 8 x 8 |
31.9 | 27.3 | 25.4 |
| 208 ld | 28 x 28 | 16 x 16 | 18.1 | 15.3 | 14.4 |
LQFP Electrical Performance:
Simulated Results @100 MHz
| Pkg | Body Size (mm) | Pad Size (mm) | Lead | Inductance (nH) | Capacitance (pF) | Resistance (mOmega) |
|---|---|---|---|---|---|---|
| 32 ld | 7 x 7 | 5 x 5 | Longest | 0.904 | 0.211 | 9.2 |
| 32 ld | 7 x 7 | 5 x 5 | Shortest | 0.799 | 0.202 | 7.8 |
| 48 ld | 7 x 7 | 5 x 5 | Longest | 1.110 | 0.225 | 13.8 |
| 48 ld | 7 x 7 | 5 x 5 | Shortest | 0.962 | 0.200 | 12.0 |
| 100 ld | 14 x 14 | 8 x 8 | Longest | 2.300 | 0.419 | 26.3 |
| 100 ld | 14 x 14 | 8 x 8 | Shortest | 1.520 | 0.322 | 17.8 |
| 144 ld | 20 x 20 | 8.5 x 8.5 | Longest | 6.430 | 1.100 | 62.9 |
| 144 ld | 20 x 20 | 8.5 x 8.5 | Shortest | 4.230 | 1.070 | 52.6 |
| 176 ld | 24 x 24 | 8 x 8 | Longest | 9.510 | 1.270 | 89.0 |
| 176 ld | 24 x 24 | 8 x 8 | Shortest | 5.200 | 1.340 | 64.0 |
| 208 ld | 28 x 28 | 11 x 11 | Longest | 9.670 | 1.380 | 86.2 |
| 208 ld | 28 x 28 | 11 x 11 | Shortest | 6.190 | 1.210 | 64.8 |
LQFP Reliability Qualification:
IC chips are assembled in optimized package designs with proven reliable semiconductor materials.
| Moisture sensitivity characterization: | JEDEC Level 3, 30°C / 60% RH, 192 hrs |
| PCT: | 121°C, 100% RH, 2 atm, 504 hours |
| High temp storage: | 150°C, 1000 hrs. |
| Temp/Humidity: | 85°C / 85% RH, 1000 hours |
| Temp cycle: | -55 / +125°C, 1000 cycles |
LQFP Process Highlights:
| Die thickness: | 14.5 ± .5 mil |
| Strip Solder plating: | Matte Sn and Pre-Plated package options, (ie: Ni / Pd frames) |
| Marking: | Laser |
| Lead inspection: | Laser / Optical |
| Pack/ship options: | Bar code, dry pack |
| Wafer backgrinding: | Available |
Test Services:
- Program generation / conversion
- Product engineering support
- Wafer sort
- Burn-in
- -55°C to + 165°C test available
- 256 pin x 20 MHz test system available
Shipping:
- JEDEC outline CO-124 low profile tray
LQFP Cross Section:
For more information on the LQFP (QFP) package, please contact an Amkor Regional Sales Office near you or fill out the Request Form.