Amkor offers a broad line of LQFP (QFP) IC packages designed to provide the same great benefits as MQFP packaging with a 1.4 mm body thickness. This allows IC packaging engineers, component specifiers and systems designers to solve issues such as increasing board density, die shrink programs, thin end-product profile and portability.

For more information on the LQFP (QFP) package, please contact an Amkor Regional Sales Office near you or fill out the Request Form.