The FlipStack® CSP family utilizes Amkor's industry leading ChipArray® Ball Grid Array (CABGA
) manufacturing capabilities, in combination with Amkor's fcCSP
technology. This broad high volume infrastructure enables the rapid deployment of advances in die stacking technology across multiple products and factories to achieve lowest total cost.
FlipStack® CSP technology enables the stacking of a wide range of different semiconductor devices to deliver the high level of silicon integration and area efficiency required in portable multi-media products. FlipStack® CSP uses high density thin core substrates, advanced wafer thinning, die attach, flip chip and wire bonding capabilities to stack multiple devices in a conventional fine pitch BGA (FBGA) surface mount package. Many customers have relied on Amkor to solve their highest density and most complex device stack combinations.
As a result, Amkor has established industry leadership in stacking complex mixed signal, logic + memory devices, including digital base band or application / processors + high density flash or mobile DRAM devices. Designers are looking to FlipStack® CSP technologies to achieve integration, size and cost reductions in chip set combinations.