Amkor’s Flip Chip Molded BGA (FCmBGA) is the evolution of the Super Flip Chip (SuperFC / FCBGA) high performance flip chip solution. Capillary underfill (CUF) is replaced by molded underfill (MUF). FCmBGA provides additional benefits such as improved board real estate use, by allowing closer spacing between passives and the flip chip die, better warpage control for thin core substrates and improved solder joint reliability for passives. FCmBGA also extends the die size range for bare die packages and it is a potential cost reduction over lidded Flip Chip BGA (FCBGA). Advanced molding techniques coupled with next generation mold compounds are used to produce FCmBGA.

FCmBGA packages are designed to allow die protrusion over the mold cap. This ensures the thinnest band line and best thermal impedance between Flip Chip (FC) die and the attached heat sink.

Flip Chip Molded BGA is produced in an exposed die configuration. This configuration maintains the excellent thermal performance of bare die Flip Chip BGA and it enhances it by providing a support surface around the die for direct heat sink attach. For small to medium die size, 8-14mm, FCmBGA provides excellent coplanarity without the need for a stiffener / lid or formed lid configurations. For larger die sizes, lower CTE substrates coupled with improved molding compound properties are being evaluated.

Note: Portfolio based on theoretical calculations - designs not complete for all options. All data on this data sheet is Preliminary. 

For more information on the FCmBGA or Flip Chip BGA (FCBGA) packages, please contact an Amkor Regional Sales Office near you or fill out the Request Form.