Amkor’s flip chip molded BGA (FCMBGA) package enables thinner packaging and improves thermal performance while reducing system cost. Presenting an exposed die format, the package uses a molding compound that replaces traditional capillary underfill to assemble larger die (≤20mm) onto BGA substrates (15mm - 42.5mm) without the structural need for a lid or stiffening ring. The technology was designed to address several considerations from improved reliability to reduced cost.
Warpage control is significantly improved, especially for bare die and thin core substrates, because the molding compound ruggedizes the structure. This enables the packaging of larger die in systems demanding ultra-low profiles. The molding compound locks the structure in place much like traditional underfill, extending solder joint reliability over a larger area.
Since the molding compound contains a higher filler content and lower moisture absorption than capillary underfills, the FCMBGA will also support ultra low-k nodes. This is especially important in next generation products that must support our customer's functional integration roadmaps.
Both the die and peripheral passive components can be assembled simultaneously. This, in addition to eliminating underfill dispense, results in a lower cost assembly. And because the passive components can now be mounted very close to the die on the package substrate, it improves substrate real estate usage - which may also translate into improved board real estate savings.
A lid or heat spreader attached to the exposed back of the die is optional, depending upon the thermal requirements of the device. Elimination of the lid also greatly reduces package cost.
This type of package is initially being adopted for high-performance and low-cost applications with FPGA devices being the first to go into production. The FCMBGA supports applications such as networking and storage, gaming, broadband communications, computer and mobile communications.
FCMBGA has been qualified to MRT L3 260°C and has completed customer qualification.
|High temp storage:||1000 hours|
|Temp cycle "B"||1000 cycles|
|HAST "A":||96 hours|
|FCMBGA has also completed BLR testing. Test board per IPC9701:||3500 cycles 0 to 100°C, 1.5 cycles / hour
FCMBGA packages are designed to allow die protrusion over the mold cap. This ensures the thinnest bond line and best thermal impedance between the Flip Chip die and the attached heat sink.
|Body (Max):|| 42.5 mm|
|Die Size (Max):||20 mm|
|Bump Pitch (Min):||150 µm|
|Package Substrate:||Build up and coreless laminates|
|Mold Compound:||Fine filler, Ultra low alpha|
|Bumps:||Eutectic, Lead Free, Cu Pillar|
|Balls:||Eutectic, Lead Free|
Please contact the Test Product Group for details on the services available.
The product is shipped in standard JEDEC trays.