ExposedPad (ePad) TSSOP, MSOP, SOIC & SSOP are leadframe based, plastic encapsulated packages that are well suited for applications requiring optimum thermal performance, compressed body size and tightened lead pitch. These industry standard IC packages offer a substantial increase in heat dissipation, yield a significant reduction in size and provide value-added, low-cost solutions for a wide range of applications. A green BOM is standard, allowing devices to meet applicable Pb free and RoHS standards.
Features:
- Cu wire interconnect for lowest cost
- Standard JEDEC package outlines
- Multi-die production capability
- Turnkey test services, including strip test options
- ExposedPad configuration for increased thermal efficiency
- Up to 60% improvement in Theta JA (compared to standard TSSOP or SOIC)
- Green materials are standard - Pb free and RoHS compliant
Services and Support:
Amkor has a broad base of resources available to help our customers bring quality new products to market quickly and at the lowest possible cost.
Custom leadframes- Full package characterization
- Thermal, Mechanical and Stress and Electrical performance modeling
- Turnkey assembly, test and drop ship
- World class Reliability testing and Failure analysis
New Developments:
- Stealth dicing (narrow saw streets)
- Larger / Higher Density leadframe strips
- Leadframe roughening for improved MSL capability
Thermal Performance:
Forced Convection, Single-Layer PCB; JEDEC Standard Test Boards
Theta JA (°C/W) by Velocity (LFPM)
| Pkg | Body Size (mm) | Pad Size | 0 | 200 | 500 |
|---|---|---|---|---|---|
| MSOP 8LD* |
3.0 x 3.0 |
1.73 x 2.39 | 38.0 | 33.0 | 31.0 |
| TSSOP 16LD* | 4.4 x 5.0 | 3.0 x 3.0 | 37.6 | 32.3 | 30.2 |
| TSSOP 20LD | 4.4 x 6.5 | 3.0 x 4.2 | 37.6 | 32.3 | 29.9 |
| TSSOP 28LD* | 4.4 x 9.7 | 3.0 x 5.5 | 37.0 | 32.0 | 29.0 |
| TSSOP 56LD* | 6.1 x 14 | 4.7 x 5.5 | 33.5 | 30.0 | 28.0 |
| SOIC 8LD | 3.9 x 4.9 | 2.3 x 2.3 | 58.6 | 52.1 | 49.4 |
| SSOP 16LD | 3.9 x 4.9 | 2.4 x 2.3 | 4.3 | 38.5 | 36.1 |
* = Estimates
Electrical Performance:
Simulated Results @100 MHz
| Pkg | Body Size | Pad Size | Center Inductance (nH) | Corner Inductance (nH) |
|---|---|---|---|---|
| MSOP 8 ld | 3.0 x 3.0 | 1.73 x 2.39 | 1.50 | 2.20 |
| TSSOP 16 ld | 4.4 x 5.0 | 3.0 x 3.0 | 1.58 | 2.28 |
| TSSOP 20 ld | 4.4 x 6.5 | 3.0 x 4.2 | 1.68 | 2.45 |
| TSSOP 28 ld | 4.4 x 9.7 | 3.0 x 5.5 | 1.70 | 2.65 |
| TSSOP 56 ld | 6.1 x 14 | 4.7 x 5.5 | 1.90 | 2.85 |
Reliability Qualification:
Amkor package qualification uses three independent production lots and a minimum of 77 units per test group. All testing includes JSTD-020 moisture preconditioning.
| MSL: | JEDEC Level 1, 85°C / 85% RH, 168 hrs |
| MSL: | JEDEC Level 3, 30°C / 60% RH, 192 hrs |
| uHAST: | 130°C / 85% RH, No Bias, 96 hrs |
| HTS: | 150°C, 1000 cycles |
| Temp cycle: | 65°C / +150°C, 500 cycles |
Process Highlights:
- Cu wire bonding standard
- Wafer backgrinding services available
- Multiple die and die stacking capability
- NiPdAu (PPF) or Matte Sn lead finish options
- Laser Mark on package body
Test
Services:
- Program generation / conversion
- Wafer probe
- Burn-in
- -55 °C to +165 °C test available
- Strip test available
Shipping:
- Clear anti-static tube, 20 inch
- Tape and reel
- Bar code
- Dry pack
- Drop ship
Cross Sections:
Package Configuration Options:
ExposedPad MSOP, ePad TSSOP, ePad SOIC, ePad SSOP Nominal Package Dimensions
(units in mm unless otherwise noted)
For more information on the ExposedPad TOSSP, ExposedPad MSOP, ExposedPad SOIC, & ExposedPad SSOP package, please contact an Amkor Regional Sales Office near you or fill out the Request Form.
