This Amkor developed family of power IC packages significantly increases the thermal efficiency of power constrained standard LQFP and TQFP packages. The ExposedPad LQFP / TQFP can increase heat dissipation by as much as 110% over a standard LQFP / TQFP, thereby expanding the margin of operating parameters. Additionally, the ExposedPad can be connected to ground, thereby reducing loop inductance for high frequency applications. The ExposedPad should be soldered directly to the PCB to realize the thermal and electrical benefits. 3D packaging with die stack process are also provided in this package for MCP solution.

ExposedPad LQFP / TQFP Applications:

Increased end-application densities and shrinking product sizes demand more from IC packages. ExposedPad LQFP / TQFPs give designers the needed margin for designing and producing high performing products such as telecom, magnetic / optical disk drives, pagers, wireless, CATV / RF modules, LCD / flat panel TVs, radio, Netbooks and other similar applications. GaAs and hi-speed silicon technologies work especially well in ExposedPad LQFP / TQFP packages due to added shielding and grounding capabilities.

ExposedPad TQFPExposedPad LQFP / TQFP Features:

Amkor’s ExposedPad LQFP / TQFP IC package portfolio provides:

  • 5 x 5 mm to 28 x 28 mm body size
  • 32 to 256 lead counts
  • Broad selection of die pad sizes
  • Double down-set ground bond ring pad
  • Copper leadframes
  • 1.0 mm body thickness for TQFP
  • 1.4 mm body thickness for LQFP
  • Custom leadframe design available
  • ExposedPad is easily inverted for heat sink attach
  • Low Profile - < 1.2 mm max mounted height
  • Electrical - Very low loop inductance with use of paddle as ground path, more pins available for signal and allows for operating frequencies of up to 2.4 GHz

 

ExposedPad LQFP / TQFP Thermal Resistance:

Multi-Layer PCB, JEDEC Standard Test Boards, Tested @1 W, With die attach pad soldered to PCB

Theta JA (°C/W) by Velocity (LFPM)

Pkg Body Size (mm) Pad Size 0 200 500
32 ld 5 x 5 3.4 x 3.4 34.6 29.1 27.2
48 ld 7 x 7 5 x 5 27.6 22.6 20.7
64 ld 10 x 10 7.5 x 7.5 22.3 17.2 15.1
100 ld 14 x 14 10.3 x 10.3 20.6 15.3 13.4
144 20 x 20 7 x 7 20.0 15.4 13.5
*176 24 x 24 10 x 10 19.0 15.4 13.5
*208 28 x 28 11 x 11 18.7 15.5 14.0

 

ExposedPad LQFP / TQFP Reliability:

IC chips are assembled in optimized package designs with proven reliable semiconductor materials.

Moisture sensitivity Characterization:   JEDEC Level 3, 30°C / 60% RH, 192 hours - 3x reflow - SAT
Temp / Humidity:   85°C / 85% RH, 1000 hours
HAST wwith precon:   130°C / 85% RH, 96 hours
High temp storage:   150°C, 1000 hours
Temp cycle w/ precon:   -65 to + 150°C, 1000 cycles


ExposedPad LQFP / TQFP Process Highlights:

Die Thickness for TQFP:   11.5 ± 0.50 mils
Die Thickness for LQFP:   14.5 ± 0.50 mils
Lead finish:   100% Matte Sn Standard / Pre-plated leadframe capa is selectively available
Marking:   Laser
Bond pad pitch:   0.050 mm
Wire diameter:   0.8 mil Standard
Wafer backgrinding:   Available
Pack/ship options:   Bar code, dry pack

 

Test Services:

  • Program generation / conversion
  • Product engineering support
  • Wafer sort
  • 256 pin x 20 MHz test system available
  • Burn-in
  • Tape and reel services
  • -55°C to +165°C test available

 

Shipping:

  • JEDEC outline CS-007 low profile tray

 

ExposedPad LQFP / TQFP Cross Sections:

ePad LQFP / TQFP Cross section

 

ExposedPad LQFP / TQFP Configuration Options:

epad QFP Options

For more information on the ePad LQFP / TQFP package, please contact an Amkor Regional Sales Office near you or fill out the Request Form.

Packaging



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