Amkor's ChipArray CASON packages are laminate-based products available as QFN / QFP (Quad Flat No-Lead) packages. These packages typically have single row of package terminals around the perimeter of the package body. This produces a low profile package able to fit a standard motherboard footprint of standard lead frame packages such as SOIC, SSOP and MicroLeadFrame®. This package technology allows for increased die size without increasing the package area required for mounting onto a motherboard. The package is fully overmolded, allowing the terminals to be under the package and die area.
This IC packaging technology is applicable for semiconductors such as memory, analog, ASICs, Logic, analog, RF Devices and simple PLDs requiring a smaller package size than conventional PBGAs. ChipArray packages fill the need for low cost, minimum space and high speed requirements of mobile phones and pagers, notebook and subnotebook personal computers, global positioning systems (GPS), PDAs and other wireless telecommunication systems.
Innovative designs and expanding package offerings provide a platform from prototype-to-production.
Amkor assures a reliable performance by continuously monitoring key indices:
|Moisture sensitivity characterization:||JEDEC Level 3, 30°C / 60% RH, 192 hours|
|Autoclave:||121°C, 2 atm, 168 hours|
|Temp Cycle:||-55 / +125°C, 1000 cycles|
|Temp / Humidity:||85°C / 85%, 1000 hours|
|High temp storage:||150°C, 1000 hours|
|Body Size:||2 x 3||5 x 6||5 x 8||3 x 3||3.5 x 4.5||4.5 x 5.5|
||6||8||8||32||20 / 24||28|