ChipArray® BGA (CABGA / LFBGA)
Thin ChipArray® BGA (CTBGA / TFBGA)
Very Thin ChipArray® BGA (CVBGA / VFBGA)
Amkor’s ChipArray® packages are laminate-based Ball Grid Array (BGA) packages that are compatible with established SMT mounting processes. The near-chip-size standard outlines offer a broad selection of ball array pitch, count, and body sizes. In addition to the standard core ChipArray package (CABGA), Amkor offers thin core substrate ball and land grid array packages which, coupled with very thin mold cap, achieve package thicknesses down to 0.50 mm max. By utilizing a thin core laminate, much denser routing can be achieved, thereby enabling more I/Os in a given footprint.
Amkor ChipArray packages, regardless of body size and thickness, utilize the same flexible capacity which assures economical packaging solutions. High volume processes and innovative design assure high quality and cutting edge technology. Due to their small size and I/O density, Amkor’s ChipArray product family is an excellent choice for new devices requiring a small footprint size and low mounted height. LGA options are avaliable with screen printed bumps. Die thinkess is also dependent on the wire loop height requirement.