Amkor’s ChipArray® Ball Grid Array (CABGA) packages are laminate based packages that are compatible with SMT mounting processes world wide. The near chip size CABGA fine-pitch BGA (fBGA) offers a broad selection of ball array pitches (≥ 0.3 mm pitch), ball counts and body sizes (1.5 mm to 27 mm body), single and multi-die layouts, stacked die (1-16) and passive component (up to 300) integration.
Copper (Cu) wire is today’s fastest growing interconnect method and Amkor offers high volume infrastructure on atest generation Cu wire bond equipment at all Amkor ABGA production locations.
Thin core laminate (1 to 6 metal layer) from the strongest supply chain in the industry, ultra-thin mold cap thickness and Si thinning below 75 μm enable next generation tablets, mobile handsets, game controllers, digital still & video cameras and remote devices.
Advances in substrate surface finishes and routing techniques reduce gold costs while improving electrical and board level reliability performance. Electrical shielding methods for reducing EMI. Innovative thermal package structures offer cost competitive solutions to the most challenging thermal management needs.