ChipArray® BGA (CABGA / LFBGA)
Thin ChipArray® BGA (CTBGA / TFBGA)
Very Thin ChipArray® BGA (CVBGA / VFBGA)

Amkor’s ChipArray® packages are laminate based Ball Grid Array (BGA) packages that are compatible with established SMT mounting processes. The near-chip-size standard outlines offer a broad selection of ball array pitch, count, and body sizes. In addition to the standard core ChipArray package (CABGA), Amkor offers thin core ball grid array packages (CTBGA and CVBGA) which, coupled with a thin mold cap, achieve package thicknesses down to 1.0 mm max. By utilizing a thin core laminate, much denser routing can be achieved, thereby enabling more I/Os in a given footprint.

Amkor ChipArray packages, regardless of body size and thickness, utilize the same, flexible capacity which assures economical packaging solutions. Further, high volume processes and innovative design assure high quality and cutting edge technology. Due to their small size and I/O density, Amkor’s ChipArray product family is an excellent choice for new devices requiring a small footprint size and low mounted height.

For more information on the CABGA, CTBGA or the CVBGA package, please contact an Amkor Regional Sales Office near you, your Account Manager or fill out the Request Form.