3-dimensional (3D) packaging technologies exploit the third or Z height dimension to provide a volumetric packaging solution for higher integration and performance. 3D packaging has become critical to integrating the multi-media features consumers demand in smaller, lighter products. This increasing functionality requires higher memory capacity in more complex and efficient memory architectures.

 

New product designs (cell phones, digital cameras, PDAs, audio players and mobile gaming) demand that these features be delivered in innovative form factors and styling. 3D packaging is experiencing high growth and new applications by delivering the highest level of silicon integration and area efficiency at the lowest cost.

 

For more information on our 3D & Stacked-Die Packaging Technology Solutions, please contact an Amkor Regional Sales Office near you or fill out the Request Form.